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PhD, Master or Bachelor degree in Mechanical/Material/Electrical/Electronic Engineering or Physics
7+ years of process engineering experience in semiconductor assembly on engineering for equipment maintenance/repair/improve in SMT.
Accept flexible working time if needed.
Able to read Garber data and define stencil design.
Knowledge on DP process; wafer backgrind, wafer saw, wafer laser cutting, Cool/Hot expander and laser grooving machine.
Experience in handling the high die stack DA, 1D until 16D with very thin die capability.
Involved in yield improvement activities using statistic tools and drive yield meeting with internal and external team.
Lean Six Sigma Knowledge is preferable.
Basic understanding of package level testing & reliability.
Proficient in standard business application software, Tools & standard engineering method (Word, Excel, PowerPoint, AutoCAD, JMP, SPC, DOE, DMAIC, 8D, 5-why etc.).
A proven desire to work as a team member, both on the same team and outside of the team.
Ability to troubleshoot and analyze complex problems.
Ability to multi-task and meet deadlines.
Excellent English communication (written and verbal) and interpersonal skills.
Responsible for day-to-day installation / repair work, troubleshooting and maintenance.
responsible for fully supporting the Department Manager on the development of the company goals, strategy and tactics.
Able to work with the other team to assure the good execution of daily activities and special assignments assigned by department managers or higher management.
Responsible to lead the process engineering functions for SMT, DP and DA process.
He/she is required to work closely with the teams within Assembly Process Engineering department as well as other functional teams; manufacturing, EE, IPPC, QA and other supporting teams to fully support the company and department goals on yield, quality, and cost, utilization, productivity and cycle time.
Good knowledge in SMT, Die Preparation and Die Attach process.
Able to lead a group of process engineers and technician. Be a mentor and coach for the engineers and technicians, provide the technical supports whenever necessary.
Good in problem solving skills by applying the standard solving methodology, DMAIC, 8D, etc.
Good working knowledge in MSA & SPC and DOE
Document of SOP, WI, FMEA, FMEA+, OCAP and Control Plan for related process.
Ensure effective hand shaking process of new device/product introduction to the line and new process technology capabilities developments.
Responsible for new material/component first articles inspection and final buyoff.
Continuous improvement on direct/indirect material cost down & yield enhancement program.
Ensure robustness of process control to meet yield & through-put expectation.
Report any non-conformance/customer complains issue and develop/follow up the improvement actions.
Lead or work together with other sites of WD for project transfer or sharing of improvement projects.
Fully participate to resolve the issue thru teamwork and be the main coordinator for any internal/ external audit programs.
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