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Senior Manager Process Engineering

Western Digital

Full Time

Sungai Jawi, Pulau Pinang

Jadilah pemohon terawal!

Posted 3 months ago • Closing 1 Mar 2021

Jadilah pemohon terawal!

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Kelayakan

  • PhD, Master or Bachelor degree in Mechanical/Material/Electrical/Electronic Engineering or Physics
  • 7+ years of process engineering experience in semiconductor assembly on engineering for equipment maintenance/repair/improve in SMT.
  • Accept flexible working time if needed.

 PREFERRED:

  • Able to read Garber data and define stencil design.
  • Knowledge on DP process; wafer backgrind, wafer saw, wafer laser cutting, Cool/Hot expander and laser grooving machine.
  • Experience in handling the high die stack DA, 1D until 16D with very thin die capability.

SKILLS:

  • Involved in yield improvement activities using statistic tools and drive yield meeting with internal and external team.
  • Lean Six Sigma Knowledge is preferable.
  • Basic understanding of package level testing & reliability.
  • Proficient in standard business application software, Tools & standard engineering method (Word, Excel, PowerPoint, AutoCAD, JMP, SPC, DOE, DMAIC, 8D, 5-why etc.).  
  • A proven desire to work as a team member, both on the same team and outside of the team.
  • Ability to troubleshoot and analyze complex problems.
  • Ability to multi-task and meet deadlines.
  • Excellent English communication (written and verbal) and interpersonal skills.

Tanggungjawab

  • Responsible for day-to-day installation / repair work, troubleshooting and maintenance.
  • responsible for fully supporting the Department Manager on the development of the company goals, strategy and tactics.
  • Able to work with the other team to assure the good execution of daily activities and special assignments assigned by department managers or higher management.
  • Responsible to lead the process engineering functions for SMT, DP and DA process.
  • He/she is required to work closely with the teams within Assembly Process Engineering department as well as other functional teams; manufacturing, EE, IPPC, QA and other supporting teams to fully support the company and department goals on yield, quality, and cost, utilization, productivity and cycle time.
  • Good knowledge in SMT, Die Preparation and Die Attach process.
  • Able to lead a group of process engineers and technician. Be a mentor and coach for the engineers and technicians, provide the technical supports whenever necessary.
  • Good in problem solving skills by applying the standard solving methodology, DMAIC, 8D, etc.
  • Good working knowledge in MSA & SPC and DOE
  • Document of SOP, WI, FMEA, FMEA+, OCAP and Control Plan for related process.
  • Ensure effective hand shaking process of new device/product introduction to the line and new process technology capabilities developments.
  • Responsible for new material/component first articles inspection and final buyoff.
  • Continuous improvement on direct/indirect material cost down & yield enhancement program.
  • Ensure robustness of process control to meet yield & through-put expectation.
  • Report any non-conformance/customer complains issue and develop/follow up the improvement actions.
  • Lead or work together with other sites of WD for project transfer or sharing of improvement projects.
  • Fully participate to resolve the issue thru teamwork and be the main coordinator for any internal/ external audit programs.

Manfaat

  • Multinational Exposure  
  • Annual Leave 
  • EPF SOCSO  
  • Career Growth

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About Company

jobs in Western Digital

Western Digital

Engineering / Technical Consulting

Lihat Syarikat ▶

About Company

jobs in Western Digital

Western Digital

Engineering / Technical Consulting

Lihat Syarikat ▶