Full Time Head of R-D — Wide-Bandgap (SiC-GaN) Power Packaging Jobs, in Carsem (M) Sdn. Bhd. Perak - Maukerja

Carsem, part of the Hong Leong Manufacturing Group, is a global semiconductor assembly and test leader with over 30 years in power packaging and more than 15 years of copper clip development. As wide-bandgap (SiC and GaN) devices reshape power electronics for automotive, industrial, AI and computing applications, we are seeking an accomplished Head of Research & Development to lead the technology and product development agenda for our Wide-Bandgap business.

Reporting to the General Manager – WBG, you will own the technology roadmap, the R&D pilot line, and the commercialization of next-generation power packaging solutions, leading a team of approximately 15 through 5 direct reports.

Key Responsibilities

• Define and drive the R&D and technology roadmap for wide-bandgap (SiC and GaN) power semiconductor packaging.
• Lead development and industrialization of advanced interconnect and assembly technologies, including silver/copper sinter die attach, copper clip, DBC/AMB substrates, encapsulation and
• thermal management.
• Take new packages, materials and processes from concept through pilot line to qualified mass production.
• Oversee R&D pilot line operations, modeling and simulation, and continuous improvement.
• Serve as senior technical partner to customers on new product, material and process development.
• Lead value engineering and materials cost reduction without compromising reliability.
• Own patent and IP strategy across Carsem's M-site and S-site.
• Build, mentor and lead a multidisciplinary R&D organisation.

Requirements

• Senior R&D or technology development leadership in semiconductor packaging, with a proven track record in power packaging (power modules and/or power discretes).
• Direct, hands-on experience in wide-bandgap (SiC and/or GaN) power device packaging.
• Deep command of assembly and test processes, IC and power packaging materials, and reliability physics of high-power, high-temperature packages.
• Proven success industrializing new packages from development through qualification to mass production, including automotive-grade qualification where applicable.
• Strong project management to mass production, budgeting and business planning, and lean manufacturing knowledge.
• Demonstrated people leadership, with accountability for team performance and development.
• Bachelor's Degree in Electrical & Electronic Engineering, Physics, Materials Science or equivalent; postgraduate qualification an advantage.

Preferred

• Hands-on knowledge of sinter die attach (Ag/Cu), copper clip, DBC/AMB substrates and advanced thermal management.
• Exposure to automotive power electronics, EV traction inverters, or industrial and renewable power applications.
• Experience across multi-site technology transfer and global R&D collaboration.