jobs in ADVANCED SUBSTRATE TECHNOLOGIES PTE. LTD.

Full Time CMP Process Engineer Jobs, Salary up to SGD 4,500 in ADVANCED SUBSTRATE TECHNOLOGIES PTE. LTD. West Region (Singapore) - Maukerja

CMP Process Engineer

ADVANCED SUBSTRATE TECHNOLOGIES PTE. LTD.

SGD4,500 - SGD4,500 Per Month

West Region (Singapore)

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Working Location

  • 9 PESAWAT DRIVE West Region (Singapore) Singapore

Job Description

Responsibilities

Job Responsibilities

Process Development & Optimization                  

  • Develop and refine CMP processes for planarizing dielectric and metal layers (e.g., copper, dielectric, etc.) in advanced substrate manufacturing. 
  • Optimize polishing recipes, pad/slurry combinations, and process parameters to achieve planarity, low defectivity, and target thickness. 

Equipment & Tooling Support                   

  • Define equipment specifications and validate CMP tools. 
  • Monitor and maintain CMP tool performance, including pad conditioning, slurry delivery systems, and endpoint detection technologies. 

Yield & Quality Improvement                     

  • Investigate and resolve CMP-related defects (e.g., dishing, erosion, scratching, delamination). 
  • Implement process monitoring techniques like thickness metrology (e.g., ellipsometry, profilometry) and defect inspection. 

Process Integration 

  • Collaborate with upstream and downstream process owners (e.g., plating, lithography, etching) to ensure seamless integration. 
  • Support the development of process flows for advanced packaging substrates including SAP/ Damascene, ABF/PI/PID-based technologies. 

Data Analysis & Documentation    

  • Perform statistical analysis (e.g., DOE, SPC) to identify and control critical process parameters. 
  • Document standard operating procedures (SOPs), work instructions, and control plans. 

Cross-Functional Collaboration

  • Work closely with design, product engineering, equipment vendors, and manufacturing teams to support process scale-up and new product introduction (NPI). 
  • Assist with customer qualifications and reliability testing as needed. 

Perform any other ad-hoc duties as assigned by the Manager, as required to support the team and organizational goals.

Job Requirements

Professional Qualifications:

  • PhD or Master’s degree in Materials Science, Chemical Engineering, Mechanical Engineering, or a related field. 
  • 5–10+ years of experience in CMP process development in semiconductor packaging, wafer fabrication, or substrate manufacturing. 
  • Hands-on experience with CMP tools. 
  • Solid understanding of substrate technologies such as Damascene, SAP, ABF build-up, or Embedding. 

Specialized Knowledge & Skills:

  • Experience with defect analysis tools (e.g., optical inspection, SEM, AFM). 
  • Familiarity with process integration for advanced packaging (e.g., 2.5D/3D IC, interposers). 
  • Knowledge of slurry chemistry, pad materials, and post-CMP cleaning processes. 
  • Strong analytical, documentation, and problem-solving skills. 
  • Good communication and teamwork in a cross-functional environment. 

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