jobs in NXP Semiconductors

Full Time Packaging Development Engineer Jobs, in NXP Semiconductors Federal Territory - Maukerja

Packaging Development Engineer

Undisclosed

KL City, Federal Territory

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Working Location

  • Kuala Lumpur Federal Territory Malaysia

Job Description

Responsibilities

Responsibilities

  • Lead, plan, and execute projects related to process assembly development and validation
  • Design, execute, and analyze process related experiments
  • Use software to analyze data including statistical analysis
  • Solve process issues using creative problem solving techniques
  • Create process recipe for packaging development, qualify and transfer for high volume production
  • Set up new specifications and procedures for production
  • Initiate sharing of lesson learnt and best practices among manufacturing sites
  • Lead / participate in Task Force Teams
  • Identify risks and actions for risk mitigation manufacturing operation
  • Lead / support process qualification activities

Requirements

  • Minimum Bachelor’s degree in Engineering or Sciences (or related field). Master or PhD holder is preferred.
  • Good aptitude in statistical data analysis and problem solving skills
  • Must exhibit pro-activeness in leading process characterization work, ability to take on new challenges an embrace changes
  • Basic knowledge of project planning and experience in driving small projects
  • Excellent communication and presentation skills
  • Must demonstrate good initiative, collaboration, and interpersonal skills working with cross functional teams
  • Must be committed to meet process / project deadlines and commitments

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