Full Time Senior Package Designer Jobs, Salary up to SGD 9,000 in SILICON BOX PTE. LTD. East Region (Singapore) - Maukerja

Position Summary

The Senior Packaging Designer (BGA & Substrate & WLCSP) is responsible for product and tooling design.

Candidates with wafer bumping, WLCSP, BGA or fanout packaging experience are encouraged to apply for this position.

Responsibilities

• With reference to internal design guidelines, work with the internal & external customer to:

• Generate, update, and revise electrical routing layout based on the netlist or design provided by external customers.

• Generate test vehicle design and the related PCB design.

• Prepare design risk assessment report.

• Generate reticle and stencil design.

• Generate other schematics or drawing as requested.

• Review, maintenance and update the design guidelines.

• Manage the conversion of internal design into suppliers’ final design.

• Document all the drawing revisions and change records.

• Support audits

• Any other ad-hoc duties as assigned
  
  

Requirements

• At least a Bachelor’s Degree in Electrical/ Electronics Engineering, or similar discipline

• Preferably 5 - 10 years hand-on experience of using Cadence APD in RDL routing and mask design for wafer-level processes including Wafer bumping, WLCSP, BGA, eWLB and other fan-out processes. Other similar experience could be considered if relevant.

• Good understanding on the design guidelines and familiar in generating risk assessment report based on Fan-in/ Fan-out process capability.

• Familiar with other design software like Linkcad, CAM350, AutoCAD, GDS editor and Gerber editors.

• Familiar with PCB test board design.

• Knowledge and understanding of wafer-level process and product reliability as well as other packaging assembly process would be advantageous.

Silicon Box Pte Ltd is one of Asia’s fastest growing technology unicorn, at the forefront of semiconductors integration, emerging from the new horizon of Chiplets integration trends in the semiconductor industry, driven by the needs of "dis-integration", benefits of faster time-to-market and lower cost of new device design.

We provide services of semiconductor design of Chiplets at the leading edge of semiconductor device integration scheme with the next generation of advanced packaging manufacturing technologies.