- Seremban Negeri Sembilan Malaysia
Full Time ENGR I, PROCESS MFG (BACKEND) Jobs, in Onsemi Negeri Sembilan - Maukerja
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Job Description
Responsibilities
Job Description
Responsible for developing, sustaining, and improving QFN molding processes to achieve optimum product quality, manufacturing efficiency, yield, reliability, and cost performance. The engineer will lead process troubleshooting, continuous improvement activities, and new package/product qualifications related to mold operations.
Responsibilities
Responsibilities of QFN Mold Engineer
degree holder in engineering field in Mechanical, electrical, mechatronics and materials
About Us
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
*************
About The Team
We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.
Responsible for developing, sustaining, and improving QFN molding processes to achieve optimum product quality, manufacturing efficiency, yield, reliability, and cost performance. The engineer will lead process troubleshooting, continuous improvement activities, and new package/product qualifications related to mold operations.
Responsibilities
Responsibilities of QFN Mold Engineer
- Own and sustain QFN molding processes to ensure stable production, high yield, and product quality.
- Monitor and improve molding KPIs including yield, scrap rate, machine utilization, and cycle time.
- Perform troubleshooting and root cause analysis for molding-related issues such as warpage, delamination, voids, package crack, mold flash, incomplete fill, and wire sweep.
- Lead process optimization activities through DOE, statistical analysis, and continuous improvement methodologies.
- Develop and maintain process specifications, OCAP, control plans, and engineering documentation.
- Support new product introduction (NPI), package qualification, and material evaluations.
- Drive yield improvement and cost reduction projects to enhance manufacturing performance.
- Collaborate with Production, Quality, Equipment, and Maintenance teams to resolve process and equipment issues.
- Review and qualify molding materials, tooling, and process changes.
- Analyze process data and implement corrective and preventive actions (CAPA) to improve reliability and quality.
- Provide technical coaching and guidance to technicians and operators.
- Support customer audits, internal audits, and quality improvement initiatives.
- Ensure compliance with safety, quality, and manufacturing standards.
degree holder in engineering field in Mechanical, electrical, mechatronics and materials
About Us
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
*************
About The Team
We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.
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