Job Responsibilities
Follow SOP and carry out CAS per specification.
Execute scheduled /special preventive maintenance (PM) as per PM schedule and specifications.
Troubleshoot basic equipment related issues and minimize equipment downtime.
Maintain good housekeeping in the production floor / sub FAB / Office, andmaintenance support areas.
Ensure and follow good safety practice and alsosafe custody of tools, equipment and other properties belonging to the Module.
Know how to use measurement instruments effectively in data collection.Perform shift duties (12-hours shift) to support the runningof production in the Module and ensure equipment readiness and worthiness for production.
Assist Engineer in the installation and hook up of new orupgrading equipment.
Assist in implementing equipment improvement projects.
Execute good maintenance of support tools.
Assist new Technician/Associate Engineers on their On-The-Job-Training (OJT) by acting as their buddy.
Provide proper and accurate passed down of line issues anddocumentation (fill up and file the checklists).
Wafer scrap reduction awareness. Job Responsibilities:
Nitec / Diploma in Electrical/Electronics/Mechanical/Mechatronics Engineering or equivalent.
Min 2 years Experience in Wafer fabrication equipment and Etch equipment tools (Oxide/Metal).
Able to perform 12-hour rotating shift.
An excellent team player with good interpersonal skill.
Strong logical thinking capability and good analytical skill.
Highly committed with good ownership and accountability.
Passion for the semiconductor / manufacturing industry.
Able to adapt in a fast pace environment and work under pressure