Manage reliability qualification and risk assessments for backend assembly manufacturing changes affecting IC and discrete semiconductor devices.
Define, review, and execute change‑driven reliability qualification plans to support factory sustaining operations and continuous improvement initiatives.
Provide technical reliability risk assessments for manufacturing changes, quality excursions, and customer‑reported issues.
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This role acts as the key technical interface between Nexperia and its outsourced semiconductor manufacturing partners (subcontractors/OSATs). The engineer ensures stable, high-quality, and cost-efficient IC assembly operations by driving technical alignment, resolving production issues, and managing subcontractor performance.
Using key metrics and your own fab knowledge, you monitor the health of the Fab and redirect priorities as needed. You must become an expert at interpreting these metrics.
Escalate Safety observations to appropriate stakeholders for resolution. Ensure that issues are followed through to closure.
Identify and escalate production impactors to ensure the even and efficient flow of our production line.
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Own and manage the wafer etch process, ensuring stable performance and continuous improvement.
Provide technical leadership and timely solutions for day‑to‑day manufacturing issues.
Optimize wafer fab processes using Design of Experiments (DOE), statistical analysis, and data‑driven methodologies to improve yield, cost, quality, and cycle time.
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