We are looking for a Principal Package Design Engineer to support new semiconductor package development and continuous design improvement, primarily focusing on discrete packages. This role plays a key part in New Product Introduction (NPI) as well as mass production, ensuring robust, manufacturable, and cost-effective package designs. You will collaborate closely with package architects and cross-functional engineering teams to deliver high-quality assembly designs aligned with industry and internal standards.
What You Will Do
Lead and support lead frame package design for NPI and mass production phases, ensuring alignment with functional and manufacturing requirements
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Lead the design, coding, and deployment of automation solutions, including equipment interface drivers and laboratory automation to reduce manual work.
Collaborate with other stakeholders to ensure seamless integration of automation systems across manufacturing and lab environments.
Drive process optimization, yield improvement, and equipment reliability through automation initiatives.
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