Test Development Engineer
- Design and deploy automated test systems using C++, LabVIEW, TestStand, and custom hardware (power distribution, relay logic, DAQ, NI STS).
1 day
Development Jobs in Bayan Lepas - October 2026 - Urgent Hiring
Showing 91 jobs results for
"development"
in Bayan Lepas
Business Development Manager
- Maintain current client relationship and identifying areas for potential clients
1 day
- Provides timely and accurate information to incoming customer order status and product knowledge requests.
3 days
Product Development Engineer
- Conduct market and product trend research and feed findings to support new product development and management's strategy discussion.
14 days
Internship (HR-Business Development-Corporate Training)
- Assist with general administrative tasks such as filing, scanning, and data entry.
25 days
BUSINESS DEVELOPMENT REPRESENTATIVE
- Develop and maintain good relationships with new and existing customers.
23 days
Staff-Senior PCB Development Engineer
- Interact as change engineer for PCB layout update that requires medium design changes.
10 days
Sales Development Engineer
- Execute the front-end sales cycle framework, ensuring smooth marketing-to-sales data transfers, active lead qualification, and steady pipeline conversion.
23 days
Product Development - Manufacturing Senior Engineer
- 3 - 10 years in semiconductor field.
14 days
Business Development Representative
- Identify and approach potential customers to promote company products.
26 days
Internship for Web Development
- Monthly Allowance of RM1000 - 1500 per month.
26 days
- Serve any type of technical interface / integration demand (creation, changes, decommissioning) with central ams OSRAM integration platform SEEBURGER BIS from technical perspective, like B2B, A2A, API.
14 days
- Design and govern the front-end framework of the sales cycle to optimize marketing-to-sales intelligence transfers, lead identification, and high-value conversion strategies.
23 days
- Technical Project Lead (TPL) to define, plan and execute Product Development program (Automotive and Non Automotive) according to BCP (Business Creation Process), Leadproduct development tasks, from early concept/prototyping, through design & development to product release (MPR).
1 day
Die-Layer Attach Process Development Staff Engineer
- More than 2 years in semiconductor Die Attach/Layer Attach process engineering field.
9 days
- Work with Project Team in understanding circuit requirements and limitations.
10 days
Product Development Manufacturing Engineer
- At least 2 years of related working experience in semiconductor industry.
26 days
Business Development and Product Marketing Executive
- Develop and execute a comprehensive business development and marketing strategy to achieve revenue targets, with a specific focus on the semiconductor and electronics industries.
24 days
Business Development Representative (BDR)
- Independently implement outbound prospecting and qualification activities across assigned segments
29 days
Test Development Engineer
- Develop and implement functional test solutions that satisfy the customer’s product requirement.
30+ days
- Principal Technology Development Engineer – Thermal-Compression Bonding (TCB)
5 days
Senior Engineer (IT System Development and Support)
- 3+ years experience in integration / interfaces.
26 days
Process Development Senior Engineer (Casting-Molding)
- 2 - 5 years in semiconductor process engineering field.
26 days
Process Development Senior Engineer (Wire Bond)
- 2 - 5 years in semiconductor DA & WB process engineering field.
26 days
Engineer- Senior Engineer- Assistant Staff Engineer - Assembly Automation (Process Development)
- Determine core aspects and success criteria for automation solutions in product manufacturing and assembly processes.
11 days
Engineers (Equipment Assembly, Test, Product Test, Product Development, Equipment Wafer Sort)
- Equipment Assembly Engineer
14 days
Process Development Senior Engineer (Die Attach - Wire Bond)
- 2-3 years in semiconductor field especially in Die Attach and Wire Bond processes.
25 days