Responsible for technical handshake and knowledge transfer to Operation.
Generate and update relevant documents, eg Process Specification, PFMEA, DFMEA, OJTI, T32, PDR.
Provide inputs for updating of related documents and is responsible for their correct contents, eg Process of Record, Assembly Design Rule, Process Roadmap, Failure catalogue, Control Plan, Maintenance checklist, etc for development projects.
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Performing hands-on equipment setups, conversions, and troubleshooting to maximize machine uptime.
Actively assist in investigating equipment breakdowns to support root-cause analysis and the implementation of preventive counter measures.
This role involves supporting senior engineering teams during new technology and package ramp-ups, conducting maintenance surveillance checklist audits on assigned equipment.
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Accountable for EQ Integration (SECS/GEM, Non-SECS/GEM, Cluster Controller) and Process Control Automation (Recipe Mgmt, Sampling, Metrology, SPC, FDC)
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Accountable for EQ Integration (SECS/GEM, Non-SECS/GEM, Cluster Controller) and Process Control Automation (Recipe Mgmt, Sampling, Metrology, SPC, FDC)
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Serve as the technical expert for substrate, lead frame, and packaging-material design in semiconductor package development projects.
Develop designs, drawings, and specifications for substrates and lead frames in accordance with design guidelines, assembly rules, manufacturability, quality, and cost targets.
Lead multi-layer substrate design activities using Cadence and lead frame design using AutoCAD and/or Autodesk Inventor.
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