Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.
Lead and manage a wafer fab manufacturing engineering module specializing in Wet Etch and Electroplating processes
Manage and develop a team of engineers and technicians in a high‑volume manufacturing environment
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Support developing and sustaining electroplating processes (Cu TSV/Damascene/ RDL/Pillar, UBM, micro-bump) in both R&D and small volume manufacturing environments.
Support troubleshooting, root cause analysis for electroplating defects (e.g., voids, roughness, non-uniformity, adhesion issues).
Design and perform DOEs to define process windows, characterize new requirements, and evaluate plating chemistries, technologies.
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Lead end-to-end surface treatment workflows (Cleaning, Polishing, Anodizing, Plating, etc.) from NPI through Mass Production, ensuring seamless transitions between internal and external stages.
Hands-on management of in-house Cleaning, Polishing and Laboratory bath analysis.
Act as the technical lead for 3rd-party surface treatment vendors.
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