Factory Capex planning base on the loading forecast, Capex budget control and monitoring on capital utilization and efficiency.
Productivity improvement project: Lead in cost saving projects such as Productivity improvement, cycle time improvement, MMR improvement, etc. to meet company goals.
Capacity planning and analysis to meet the volume demand and maximize the plant utilization.
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Responsible for the Underfill (UF) process for flip-chip die-level assembly.
Support Assembly Process Engineering in delivering process and equipment solutions that meet quality, development, and operational requirements.
Maintain assembly yield and assembly test yield related to the Underfill process in line with department targets and KPIs, including lot bracketing and disposition.
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Own and support the Flip Chip Attach (FCA) process to achieve quality, yield, cost, reliability, and productivity targets.
Provide technical support to Advanced Process Engineering in delivering process and equipment solutions that meet operational and development requirements.
Monitor and maintain assembly yield and test yield performance related to the FCA process in alignment with departmental KPIs.
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Responsible for influencing package and product design by addressing the structural integrity and reliability issues in particular and advancing the technology of semiconductor packaging in general. The scope is to address all mechanical aspects of packaging technology and associated material and process interactions. The focus will be on solutions to meet increased demands for small form factor packages with thinner chips, denser interconnects, higher power, and higher reliability.
Responsible for the modeling and simulation, design of experiment, and testing, whichever comes first for best engineering practice, of mechanical responses of IC package and flash products including solid state drives.
This position will interface with package & product design, electrical and physical characterization, reliability testing, failure analysis, assembly R&D and other process teams.
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Optimize Test Strategies: Design and execute efficient test plans, test time, yield, and quality to meet factory financial goals. Identify cost-effective testing methods through troubleshooting, validation, and continuous improvement.
Lead and Collaborate on Engineering Solutions: Lead and implement innovative engineering solutions while collaborating with cross-functional teams to ensure project success under competitive timeline.
Champion Innovation and Cost Efficiency: Collaboratively integrate advanced testing technologies, research, and adopt cost-saving solutions like Test Time Reduction (TTR) and new test platforms, driving CAPEX reduction. Continuously improve test programs and test infrastructure to enhance product quality and reliability.
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Act as the primary technical owner for product performance in High Volume Manufacturing.
Optimize Test Strategies: Design and execute efficient test plans, test time, yield, and quality to meet factory financial goals. Identify cost-effective testing methods through troubleshooting, validation, and continuous improvement.
Lead and Collaborate on Engineering Solutions: Lead and implement innovative engineering solutions while collaborating with cross-functional teams to ensure project success under competitive timeline.
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Conduct comprehensive commonality analyses across product design, processes, machinery, materials, and measurement methodologies. Facilitate cross-functional collaboration to execute Root Cause Corrective Action (RCCA) initiatives with maximum efficacy.
Design and implement rigorous engineering Design of Experiments (DOEs) and apply advanced statistical analysis methods for complex problem-solving and data-driven decision-making processes.
Execute thorough factory Design for Mechanical Assembly and Automation (DFMA) evaluations for Solid-State Drive (SSD) assembly through meticulous examination of Design Packages, including design concepts, tolerance stack-up analyses, and Design Failure Mode and Effects Analysis (DFMEA). Actively participate in the design of machines and fixtures to enable optimal process performance.
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Provide technical leadership and ownership of test handler, defining standards for performance, reliability, and sustainability.
To accelerate machine fingerprinting deployment & Golden Line Setup for identifying quality risks through data analysis and equipment monitoring.
Driving root cause investigations and corrective actions to prevent quality escapes, while allowing the current Equipment Engineering team to remain focused on equipment reliability and NBM & NPI ramp support.
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