Perform IC (functional) Failure Analysis [FA] on wafer and package level starting from electrical verification, fault isolation and physical root cause analysis.
Prepare FA reports that can lead to root cause finding and corrective action to cross functional team. Participate, lead and present FA results in cross functional meetings, projects, yield improvement, urgent and important meetings.
Perform Discrete Devices and PCM Failure Analysis on wafer and package level from electrical verification, fault isolation and physical root cause analysis.
Prepare FA reports that can lead to root cause finding and corrective action to cross functional team.
Participate and present FA results in cross functional meetings, projects, yield improvement, urgent and important meetings.
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Perform IC (functional) Failure Analysis [FA] on wafer and package level starting from electrical verification, fault isolation and physical root cause analysis.
Prepare FA reports that can lead to root cause finding and corrective action to cross functional team. Participate, lead and present FA results in cross functional meetings, projects, yield improvement, urgent and important meetings.
Lead and perform complex in-line and off-line wafer failure analysis and defect inspection to identify defect mechanisms, root causes, and opportunities for process improvement.
Support Quality Abnormal Report (QAR) investigations, lot disposition, and release of on-hold lots in accordance with established procedures and MRB decisions.
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Perform Discrete Devices and PCM Failure Analysis on wafer and package level from electrical verification, fault isolation and physical root cause analysis.
Prepare FA reports that can lead to root cause finding and corrective action to cross functional team.
Participate and present FA results in cross functional meetings, projects, yield improvement, urgent and important meetings.
...