Common tasks include word processing, letter writing, dealing with telephone and email enquiries, creating and maintaining filing systems, arranging meetings and appointments.
Arranging both in-house and external events, booking rooms and conference facilities
Liaising with colleagues and external contacts to book travel and accommodation
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Common tasks include word processing, letter writing, dealing with telephone and email enquiries, creating and maintaining filing systems, arranging meetings and appointments.
Arranging both in-house and external events, booking rooms and conference facilities
Liaising with colleagues and external contacts to book travel and accommodation
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To provide line‑side process integration support for day‑to‑day manufacturing operations.
To act as first responder for inline process deviations, abnormal results and yield excursions & perform first‑level defect analysis and failure mode identification to support engineering decisions
To execute defect characterization using optical microscopy, SEM, FIB and EDX tools. To support execution of OCAP/FC actions including tool containment, lot holds and escalation per guidelines
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Responsible for the process of MOCVD thin film epitaxy growth, assures the operability and operational goals by sustaining and continuous improving the processes. Key KPIs include epitaxy layer performance, cost, yield, CpK, other process related KPI.
Full responsibility of MOCVD thin film epitaxy growth process. Actively liaise with production and analytic team to ensure smooth operation and meeting process KPIs.
Work closely with equipment/production team to ensure proper equipment handshake to upkeep the uptime and also quality of the wafers. Sustain the running of the equipment, daily monitoring of process parameters and addressing line operation or analytical related issues.
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Responsible for the process of MOCVD thin film epitaxy growth, assures the operability and operational goals by sustaining and continuous improving the processes. Key KPIs include epitaxy layer performance, cost, yield, CpK, other process related KPI.
Full responsibility of MOCVD thin film epitaxy growth process. Actively liaise with production and analytic team to ensure smooth operation and meeting process KPIs.
Work closely with equipment/production team to ensure proper equipment handshake to upkeep the uptime and also quality of the wafers. Sustain the running of the equipment, daily monitoring of process parameters and addressing line operation or analytical related issues.
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Provide technical troubleshooting, diagnostics, and repair support for test systems and wafer probing equipment.
Identify root causes of equipment failures and implement corrective actions to restore functionality.
Perform scheduled preventive maintenance (PM) on machines and equipment to ensure optimal performance and follow standard maintenance procedures and safety guidelines.
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To implements hardware solutions for grinding/ dicing/ LLO/ Bonding process while adhering to manufacturing capabilities. Maintains, enhances, troubleshooting and supports existing tools.
Conducts troubleshooting and repair of FE machines like dicing/ grinding/ LLO/ Bonder and other sub-tools used in FE production.
Carry out calibration/ preventive maintenance to the machine and equipment.
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To implements hardware solutions for grinding/ dicing/ LLO/ Bonding process while adhering to manufacturing capabilities. Maintains, enhances, troubleshooting and supports existing tools.
Conducts troubleshooting and repair of FE machines like dicing/ grinding/ LLO/ Bonder and other sub-tools used in FE production.
Carry out calibration/ preventive maintenance to the machine and equipment.
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To implements hardware solutions for grinding/ dicing/ LLO/ Bonding process while adhering to manufacturing capabilities. Maintains, enhances, troubleshooting and supports existing tools.
Conducts troubleshooting and repair of FE machines like dicing/ grinding/ LLO/ Bonder and other sub-tools used in FE production.
Carry out calibration/ preventive maintenance to the machine and equipment.
...
To implements hardware solutions for grinding/ dicing/ LLO/ Bonding process while adhering to manufacturing capabilities. Maintains, enhances, troubleshooting and supports existing tools.
Conducts troubleshooting and repair of FE machines like dicing/ grinding/ LLO/ Bonder and other sub-tools used in FE production.
Carry out calibration/ preventive maintenance to the machine and equipment.
...
To implements hardware solutions for grinding/ dicing/ LLO/ Bonding process while adhering to manufacturing capabilities. Maintains, enhances, troubleshooting and supports existing tools.
Conducts troubleshooting and repair of FE machines like dicing/ grinding/ LLO/ Bonder and other sub-tools used in FE production.
Carry out calibration/ preventive maintenance to the machine and equipment.
...
To implements hardware solutions for grinding/ dicing/ LLO/ Bonding process while adhering to manufacturing capabilities. Maintains, enhances, troubleshooting and supports existing tools.
Conducts troubleshooting and repair of FE machines like dicing/ grinding/ LLO/ Bonder and other sub-tools used in FE production.
Carry out calibration/ preventive maintenance to the machine and equipment.
...
To implements hardware solutions for grinding/ dicing/ LLO/ Bonding process while adhering to manufacturing capabilities. Maintains, enhances, troubleshooting and supports existing tools.
Conducts troubleshooting and repair of FE machines like dicing/ grinding/ LLO/ Bonder and other sub-tools used in FE production.
Carry out calibration/ preventive maintenance to the machine and equipment.
...
To implements hardware solutions for grinding/ dicing/ LLO/ Bonding process while adhering to manufacturing capabilities. Maintains, enhances, troubleshooting and supports existing tools.
Conducts troubleshooting and repair of FE machines like dicing/ grinding/ LLO/ Bonder and other sub-tools used in FE production.
Carry out calibration/ preventive maintenance to the machine and equipment.
...
To implements hardware solutions for grinding/ dicing/ LLO/ Bonding process while adhering to manufacturing capabilities. Maintains, enhances, troubleshooting and supports existing tools.
Conducts troubleshooting and repair of FE machines like dicing/ grinding/ LLO/ Bonder and other sub-tools used in FE production.
Carry out calibration/ preventive maintenance to the machine and equipment.
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Administer Compensation & Benefits activities, including off‑cycle adjustments and promotions, allowances processing, medical and insurance administration and market survey.
Ensure C&B actions are processed accurately and in accordance with company guidelines, approvals, and timelines
Support annual and ad‑hoc C&B exercises as required
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