The engineer will understand customer requirements and technical drawings, then prepare or revise 3D models, 2D drawings, and engineering designs based on customer needs. The role also includes preparing BOMs, supporting prototype testing, solving production and assembly issues, updating technical documents, coordinating with suppliers and internal teams, and ensuring the design is practical, safe, cost-effective.
Design, develop, and implement new manufacturing equipment, testing equipment and automation systems with robotics/vision integration to enhance efficiency and precision.
Review detailed CAD models, engineering drawings and BOMs from vendors on equipment and automation systems and challenge the designers and/or provide alternative solutions for the models.
Provide suitable mechanical components (pneumatic valves, actuators, motors, sensors, etc.) to be used in equipment and automation systems.
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NPI Execution: Drive the transition of complex semiconductor manufacturing equipment from R&D into high-volume manufacturing, ensuring seamless integration and scalability.
Electromechanical Layout: Lead the physical arrangement, packaging, and routing of mechanical structures, robotics, and electrical control panels within the machinery.
Precision Engineering: Apply an expert understanding of Geometric Dimensioning and Tolerancing (GD&T) to all manufacturing prints
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Design, develop, and implement new manufacturing equipment, testing equipment and automation systems with robotics/vision integration to enhance efficiency and precision.
Review detailed CAD models, engineering drawings and BOMs from vendors on equipment and automation systems and challenge the designers and/or provide alternative solutions for the models.
Provide suitable mechanical components (pneumatic valves, actuators, motors, sensors, etc.) to be used in equipment and automation systems.
...
As a Packaging Engineer, you will work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level.
The ideal candidate will be responsible for thermal modeling (CFD) and validation of flash products PCBA using analytical/numerical analysis and measurement techniques.
The focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments.
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As a Packaging Engineer, you will work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level.
The ideal candidate will be responsible for thermal modeling (CFD) and validation of flash products PCBA using analytical/numerical analysis and measurement techniques.
The focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments.
...
As a Packaging Engineer, you will work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level.
The ideal candidate will be responsible for thermal modeling (CFD) and validation of flash products PCBA using analytical/numerical analysis and measurement techniques.
The focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments.
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Perform other tasks as assigned by supervisors or mentors.
Willingness to learn and take the initiative.
Works under the supervision of administrative division management to gain hands-on experience in various activities related to admin support, management, business support, etc.
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