Develop and implement improved methods of manufacturing, procedures, and processes that result in improved efficiencies, yields, machine operations, and quality
Grow the Existing to Bank (ETB) SME base of retail community businesses (Sole Prop, Partnerships, or Sdn Bhds with Annual Sales Turnover (AST) of below RM 50m to grow product holdings and profitability
As Singapore’s longest established bank, we have been dedicated to enabling individuals and businesses to achieve their aspirations since 1932. How? By taking the time to truly understand people. From there, we provide support, services, solutions, and career paths that meet their individual needs and desires.
Drive 24/7 high-volume manufacturing (HVM) operations across the Bump Wafer area, achieving daily output targets, cycle time commitments, and line productivity metrics.
Lead the design and development of a comprehensive data dictionary covering five core domains: Person/Contact, Organization/Account, Membership & Affiliation, Relationship & Engagement, and Reference & Master Data.
Global Program Management: Independently lead and coordinate global Best Cost Country and localization projects from initial planning to successful factory implementation.
Lead package engineering development for Substrate-Based Power Modules, Flip-Chip, Multi-Chip Modules (MCM), and System-in-Package (SiP) architectures targeting AI acceleration and data center applications.