Packaging development engineer
- Take ownership of FC-FE die attach and underfill processes for semiconductor packages, including advanced package platforms.
2 days
Packaging Jobs in Bandar Kuala Lumpur - October 2026 - Urgent Hiring
Showing 8 jobs results for
"packaging"
in Bandar Kuala Lumpur
Packaging development engineer
- Take ownership of FC-FE die attach and underfill processes for semiconductor packages, including advanced package platforms.
23 days
External Package Innovation Engineer
- Own and lead OSAT-wide and cross-OSAT initiatives
30+ days
External Package Innovation Engineer
- Own and lead OSAT-wide and cross-OSAT initiatives
14 days
Semiconductor Package Competitive Analysis Intern
- Perform structured data mining of competitor product releases, PCNs, teardown reports, and technology announcements
30+ days
BGA WB Process Engineer
- Drive yield improvement at the BGA devices assigned to him/her .
6 days
Assembly Die Bond Process Engineer
- Develop, qualify, and optimize die bonding processes for semiconductor packages.
29 days
BGA WB Process Engineer
- Drive yield improvement at the BGA devices assigned to him/her .
29 days
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