Technical expert for lead frame / packing material in package development projects.
Perform design, drawing and specification for lead frame based on design guideline, assembly rules and ensure design for manufacturing, quality and cost.
Collaborate with internal and material supplier on packing material design, specification and selection; and ensure design for manufacturing, quality and cost.
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Vishay Intertechnology Inc. is looking for a Senior Package Development Engineer to be based in Krubong, Melaka, Malaysia. In this role, you will design, develop, and implement new sensor products and packages. You’ll source, evaluate, analyze, and recommend on new products to enhance competitive edge.
The ideal candidate will have a Bachelor’s Degree in Engineering and at least 2 years of relevant experience in semiconductor packaging processes, along with strong analytical and problem-solving skills. Benefits include health care coverage and opportunities for personal and professional growth.
Use of AutoCAD and Inventor tool in package development cycle. Understanding design systematics, creating 3D models and parametric control.
Use of CAD Desktop and SAP in Inventor use case, understanding the interactions between Inventor and SAP through CAD Desktop as well as Metadata, revisioning, file linkages, and derivations.
Design method and design flow of new package and leadframe based on technical capabilities of materials, processes and suppliers.
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Develop and implement improved methods of manufacturing, procedures, and processes that result in improved efficiencies, yields, machine operations, and quality.
Develop new automated die attach programs, optimize process parameters, and recipe standardization.
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