Nexperia in Seremban, Malaysia, is seeking an experienced leader to define and execute technology roadmaps in semiconductor packaging. You will drive the development of packaging solutions and coach a team to overcome technical challenges.
The ideal candidate should have at least 10 years in the semiconductor industry, including managerial experience. A comprehensive understanding of assembly processes and technology is crucial for this role, which promotes a culture of continuous learning and development.
This role is part of the Package Development team, responsible for leading backend assembly and package platform development, including defining and executing technology roadmaps aligned with business and product needs. The role drives development from concept to mass production, ensuring reliable, manufacturable, and cost-effective solutions.
Leads the strategic definition and execution of package platform and backend assembly technology roadmaps, ensuring alignment with business objectives and product innovation needs.
Drives the development and qualification of assembly packaging solutions from concept to mass production.
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Leads the strategic definition and execution of package platform and backend assembly technology roadmaps, ensuring alignment with business objectives and product innovation needs.
Drives the development and qualification of assembly packaging solutions from concept to mass production.
Support teams to achieve project goals by clearing technical roadblocks.
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