To develop and to industrialize die reconstruction/die attach process including glue, soft solder, DAF and flip-bond die attach for new packages, introduce materials to meet the quality, yield and mission of new application.
To support assembly of engineering sample for new packages or new technologies.
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Ensure Molding production equipment and machinery in the plant achieves minimum machine downtime and obtains minimum NCR.
Provide engineering support to Production, Engineering and QC in terms of process improvement, repairs, troubleshooting of automation and control system, calibration and process validation.
To carry out the change request and evaluate the change effects on validated process.
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Lead and execute PPAP activities including drawing review, BOM verification, specification validation, manufacturability review, and technical risk assessment during RFQ and NPI stages.
Define and establish manufacturing processes, process flow, routing sequence, manufacturing strategy, and process requirements based on customer drawings and product specifications.
Conduct DFM (Design for Manufacturability) review to identify technical risks, tolerance concerns, dimensional conflicts, process limitations, material concerns, and potential manufacturing gaps before production release.
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Lead and execute PPAP activities including drawing review, BOM verification, specification validation, manufacturability review, and technical risk assessment during RFQ and NPI stages.
Define and establish manufacturing processes, process flow, routing sequence, manufacturing strategy, and process requirements based on customer drawings and product specifications.
Conduct DFM (Design for Manufacturability) review to identify technical risks, tolerance concerns, dimensional conflicts, process limitations, material concerns, and potential manufacturing gaps before production release.
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STMicroelectronics in Malaysia is seeking a senior process leader to drive ongoing improvements in fabrication operations. You will lead a skilled FOL team, optimize quality, yield, and machine reliability, and mentor engineers through daily improvement projects.
The role requires 7+ years in semiconductor process control, strong leadership, and expertise in DOE, FMEA, SPC, and DMAIC. You will collaborate across production to sustain world-class performance and support NPI knowledge transfer.