Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.
Lead and/ or co-work with global process cluster on the development of next generation lithography for microacoustics filter and waferlevel packaging from concept to qualification and manufacturing release.
Define process requirements, success criteria, design‑of‑experiments (DOE), and characterization plans.
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Ensure process readiness, robust manufacturability, and smooth ramp‑up through strong cross‑functional coordination, data‑driven decision‑making, and process leadership.
Initiate and participate actively in discussions on formulation of process technology innovation and release process improvement.
Collaborate and develop effective working relationships with technology partners to accomplish project/ task goals within committed schedule.
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Responsible for development, qualification, and high-volume production transfer of new processes, materials, and manufacturing technologies.
Ensure process readiness, robust manufacturability, and smooth ramp‑up through strong cross‑functional coordination, data‑driven decision‑making, and process leadership.
Initiate and participate actively in discussions on formulation of process technology innovation and release process improvement.
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Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.
Drive/contribute in cost reduction, weed out unwarranted expenses/wastages, find alternative sources and improve processes with innovative solutions to raise efficiency.
Drive/contribute in quality investigations and continuous improvement programs to resolve chronic process and quality issues, and institute permanent resolutions to assure product quality and enhance process robustness.
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