To develop and to industrialize die reconstruction/die attach process including glue, soft solder, DAF and flip-bond die attach for new packages, introduce materials to meet the quality, yield and mission of new application.
To support assembly of engineering sample for new packages or new technologies.
...
Process Architecture: Lead the design and optimization of advanced plating processes (including NiPdAu/ENEPIG), wet etching, resist stripping, and precision cleaning modules.
Root Cause Analysis: Tackle complex, localized process defects—such as thickness non-uniformity or interfacial passivation—using advanced analytical tools (SEM/EDX, AFM).
Technology Scaling: Drive the transition of new wet processes from initial lab-scale concepts to robust, high-volume manufacturing (HVM) readiness.
...