Process Architecture: Lead the design and optimization of advanced plating processes (including NiPdAu/ENEPIG), wet etching, resist stripping, and precision cleaning modules.
Root Cause Analysis: Tackle complex, localized process defects—such as thickness non-uniformity or interfacial passivation—using advanced analytical tools (SEM/EDX, AFM).
Technology Scaling: Drive the transition of new wet processes from initial lab-scale concepts to robust, high-volume manufacturing (HVM) readiness.
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Develop and industrialize PLP LDI and dry film lamination processes, including material introduction, to meet quality, yield, and new application requirements.
Support the assembly of engineering samples for new packages and new technologies.
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To develop and to industrialize die reconstruction/die attach process including glue, soft solder, DAF and flip-bond die attach for new packages, introduce materials to meet the quality, yield and mission of new application.
To support assembly of engineering sample for new packages or new technologies.
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STMicroelectronics in Malaysia is seeking a senior process leader to drive ongoing improvements in fabrication operations. You will lead a skilled FOL team, optimize quality, yield, and machine reliability, and mentor engineers through daily improvement projects.
The role requires 7+ years in semiconductor process control, strong leadership, and expertise in DOE, FMEA, SPC, and DMAIC. You will collaborate across production to sustain world-class performance and support NPI knowledge transfer.