Process Architecture: Lead the design and optimization of advanced plating processes (including NiPdAu/ENEPIG), wet etching, resist stripping, and precision cleaning modules.
Root Cause Analysis: Tackle complex, localized process defects—such as thickness non-uniformity or interfacial passivation—using advanced analytical tools (SEM/EDX, AFM).
Technology Scaling: Drive the transition of new wet processes from initial lab-scale concepts to robust, high-volume manufacturing (HVM) readiness.
...
Process Architecture: Lead the design and optimization of advanced plating processes (including NiPdAu/ENEPIG), wet etching, resist stripping, and precision cleaning modules.
Root Cause Analysis: Tackle complex, localized process defects—such as thickness non-uniformity or interfacial passivation—using advanced analytical tools (SEM/EDX, AFM).
Technology Scaling: Drive the transition of new wet processes from initial lab-scale concepts to robust, high-volume manufacturing (HVM) readiness.
...
Develop and industrialize PLP LDI and dry film lamination processes, including material introduction, to meet quality, yield, and new application requirements.
Support the assembly of engineering samples for new packages and new technologies.
...