Company Overview

Our client is a Global Semiconductor Pioneer & World Leader in High-Performance Analog, Mixed-Signal & Integrated Power Processing Technologies. The Melaka manufacturing site serves as a key global hub for high-reliability back-end packaging, assembly, and testing. To maintain zero-defect output, maximize yield, and maintain automated encapsulation systems, the Process Engineering department is seeking a hands-on Mold Process Engineer.

Position Overview

Reporting to the Mold Section Manager, the Mold Process Engineer provides daily line-sustaining, process optimization, and defect-elimination support across automated molding lines. This operational engineering role focuses on managing Epoxy Molding Compound (EMC) rheology, minimizing machine downtime, and driving root-cause defect elimination across auto-molding systems.

Key Responsibilities

1. Daily Line-Sustaining & Defect Resolution

Provide daily process engineering support for high-volume transfer and compression molding production lines.
Troubleshoot, contain, and eliminate critical molding defects—including voiding, package warpage, compound flash/bleeding, wire sweep, and package delamination.
Manage Epoxy Molding Compound (EMC) parameters, evaluating compound flow, gel time, resin rheology, pellet pre-heating, and curing profiles.

2. Automated System Optimization & Yield Enhancement

Maintain and optimize automated transfer and compression molding platforms (e.g., Towa, ASM, Fico systems).
Apply Statistical Process Control (SPC), Design of Experiments (DOE), and 8D Root Cause Analysis to drive process stability, Cpk improvements, and yield enhancement.
Qualify new EMC materials, mold chase designs, and release agents for new package conversions.

Requirements

Education: Bachelor’s Degree in Mechanical, Chemical, Materials Science, or Electronics Engineering.

Work Experience: 4 to 8 years of hands-on semiconductor manufacturing experience specializing in encapsulation and molding processes.

Domain Expertise: In-depth technical knowledge of Epoxy Molding Compound (EMC) properties and hands-on operation/troubleshooting of automated molding machinery (Towa, ASM, or Fico platforms).

Methodologies: Strong proficiency in SPC, DOE, 8D problem-solving, and FMEA frameworks.

Process Engineer Jobs in Melaka City - November 2026 - Urgent Hiring

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Mold Process Engineer (Operation - Sustaining)