Develop and industrialize new materials and new processes, including Molding, Trim & Form, Solder Ball Attach, and Package Saw, for new package products such as QFP HD/SHD, BGA, PSSO/PSO, HiQuad, SOIC, and SSOP.
Support qualification lots and engineering lots to ensure timely market introduction of new packages and products.
Review and update Process Specifications, FMEA, OCAP, and Process Control Plans.
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