Serve as the principal technical expert for wafer backgrind, thinning, and metallization processes in preparation for die assembly and final test.
Provide deep technical guidance across wafer fabrication, back‑end assembly and packaging, final electrical testing, and reliability qualification.
Support yield learning, defect reduction, and root cause investigations using semiconductor failure analysis techniques, advanced data analytics, and pattern recognition approaches.
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Yield & Defect Analysis: Develop and maintain ML models to identify root causes of package failures (e.g., wire sweep, voiding, or delamination) using sensor and metrology data.
CV for Automated Inspection: Enhance and deploy Computer Vision (CNN-based) models for Automated Optical Inspection (AOI) to reduce "False Calls" and "Escapes" on the production line.
Production Deployment: Transition models from local environments (Jupyter/Python) into the factory’s execution system using Docker and REST APIs.
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Serve as the principal technical expert for wafer backgrind, thinning, and metallization processes in preparation for die assembly and final test.
Provide deep technical guidance across wafer fabrication, back‑end assembly and packaging, final electrical testing, and reliability qualification.
Support yield learning, defect reduction, and root cause investigations using semiconductor failure analysis techniques, advanced data analytics, and pattern recognition approaches.
...
Lead and manage the process engineering team, providing engineering support to the manufacturing line to achieve best-in-class quality, yield, cost, and cycle time.
Provide technical leadership and timely solutions for day-to-day manufacturing issues.
Lead the process engineering team in optimizing wafer fabrication processes using Design of Experiments (DOE), statistical analysis, and data-driven methodologies to improve yield, cost, quality, and cycle time.
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Our client, A europe headquartered semiconductor manufacturing giant, is seeking a Senior Wire Bond Equipment & Process Engineer to join their dynamic team in Malaysia.
In this role, you will leverage your expertise in wire bonding technology to optimize semiconductor manufacturing processes and ensure the highest quality and reliability in production. You will work closely with cross-functional teams, including R&D, process engineering, and manufacturing, to drive continuous improvement and innovation.
Lead and manage the process engineering team, providing engineering support to the manufacturing line to achieve best-in-class quality, yield, cost, and cycle time.
Provide technical leadership and timely solutions for day-to-day manufacturing issues.
...
Valeo is a tech global company, designing breakthrough solutions to reinvent the mobility. We are an automotive supplier partner to automakers and new mobility actors worldwide. Our vision? Invent a greener and more secured mobility, thanks to solutions focusing on intuitive driving and reducing CO2 emissions. We are leader on our businesses, and recognized as one of the largest global innovative companies.
Learn with the company’s assigned experienced staff
Project lead for new equipment or improvement action.
Follows up on LOH improvement actions, monitor effectiveness & close loop to MEEQ teams.
Continuously identify the equipment risks and update using EFMEA. Escalate issues detected, developing reject trends and close the EFMEA action as planed.
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Project lead for new equipment or improvement action.
Follows up on LOH improvement actions, monitor effectiveness & close loop to MEEQ teams.
Continuously identify the equipment risks and update using EFMEA. Escalate issues detected, developing reject trends and close the EFMEA action as planed.
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