Lead development, optimization, qualification and release of wire bond processes for new semiconductor products, package platforms and wafer technologies.
Establish robust process windows through Design of Experiments (DOE), statistical analysis and process characterization.
Develop and optimize first bond, second bond and looping processes for advanced packaging applications.
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To prepare project documents including preliminary design such as drawings and layouts, technical specifications, project calculations and other relevant documents.
Assist to compile documents and keep track of all project related paperwork.
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Define, maintain, and govern the Process Automation and Orchestration Architecture, including platform standards, integration patterns, design principles, and lifecycle management.
Develop and own the Process Automation Strategy and multi‑year roadmap, aligned with enterprise digital transformation, cost optimisation, and operational excellence objectives.
Establish and enforce architecture, design, and development standards for workflows, orchestration, integrations, and reusable components.
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