Perform Discrete Devices and PCM Failure Analysis on wafer and package level from electrical verification, fault isolation and physical root cause analysis.
Prepare FA reports that can lead to root cause finding and corrective action to cross functional team.
Participate and present FA results in cross functional meetings, projects, yield improvement, urgent and important meetings.
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Develop and lead key wafer function test hardware solutions, including tester-to-prober interfaces, probe interface boards, probe cards, docking hardware, and test head handling concepts
Translate product, equipment, and manufacturing requirements into robust hardware concepts that support different device technologies, tester platforms, prober models, and production environments
Contribute to the definition, refinement, and standardization of prober docking solutions for broader usage, with focus on repeatability, planarity control, alignment accuracy, maintainability, safety, and ease of setup
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Perform process engineering and production line sustaining for PVD process and tool
Work as a team between Manufacturing/ MNT/ UPE/ LBS/ Technology/Quality to resolve production and quality issues and reduce production line disruptions.
Support tools installations as well as process ramp, technology transfers to meet company targets, following standard process ramp; tool release business flow
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