Optimize Test Strategies: Design and execute efficient test plans, test time, yield, and quality to meet factory financial goals. Identify cost-effective testing methods through troubleshooting, validation, and continuous improvement.
Lead and Collaborate on Engineering Solutions: Lead and implement innovative engineering solutions while collaborating with cross-functional teams to ensure project success under competitive timeline.
Champion Innovation and Cost Efficiency: Collaboratively integrate advanced testing technologies, research, and adopt cost-saving solutions like Test Time Reduction (TTR) and new test platforms, driving CAPEX reduction. Continuously improve test programs and test infrastructure to enhance product quality and reliability.
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Responsible for influencing package and product design by addressing the structural integrity and reliability issues in particular and advancing the technology of semiconductor packaging in general. The scope is to address all mechanical aspects of packaging technology and associated material and process interactions. The focus will be on solutions to meet increased demands for small form factor packages with thinner chips, denser interconnects, higher power, and higher reliability.
Responsible for the modeling and simulation, design of experiment, and testing, whichever comes first for best engineering practice, of mechanical responses of IC package and flash products including solid state drives.
This position will interface with package & product design, electrical and physical characterization, reliability testing, failure analysis, assembly R&D and other process teams.
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Assure all facilities support equipment and critical utilities operate within parameters.
Assure an ongoing benchmark of energy consumption associated with facilities processes, identify opportunities for improvement and create action plans for implementation.
Assure up to date drawings of new and/or exiting facilities, machinery, equipment and processes.
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