Take ownership of FC-FE die attach and underfill processes for semiconductor packages, including advanced package platforms.
Define, develop, optimize, and maintain critical process parameters for die placement, bonding, reflow, underfill dispensing, cure, CSAM, and related process controls.
Lead design of experiments (DOE) activities to improve process yield, product reliability, void control, fillet quality, underfill flow, curing profile, and CSAM performance....
Coordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing.
Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors.
Work collaboratively with cross-functional teams, including design, technologists, program managers, and process engineering, to resolve technical issues and optimize designs for manufacturability....
Coordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing.
Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors.
Work collaboratively with cross-functional teams, including design, technologists, program managers, and process engineering, to resolve technical issues and optimize designs for manufacturability....
We are seeking a detail-oriented and proactive Senior Tax Accountant to join our Finance team. The successful candidate will be responsible for managing tax compliance, supporting tax audits, monitoring tax regulatory changes, and providing tax advisory support to business stakeholders for our Malaysia entity. This role offers exposure to both local and international tax matters within a dynamic multinational environment.
Prepare and review corporate income tax computations, tax returns, and supporting schedules.
Coordinate tax payments and monitor tax deadlines to ensure full compliance....
Own the complete ATE test hardware development lifecycle, from requirements definition and architecture through design, verification, validation, release, and production support.
Design and review complex test hardware, including load boards, probe cards, sockets, and related interfaces for wafer sort and final test applications.
Lead schematic, stack-up, component-placement, routing, and design reviews, with particular focus on signal integrity, power integrity, manufacturability, reliability, and first-time-right execution....