Support production by collecting and analyzing data to optimize line planning and execution.
Guide and lead efforts to resolve quality issues related to human factors.
Participate in addressing RTD (Return To Duty), REI (Root Cause Engineering Investigation), and automation issues occurring on the production line, ensuring timely escalation when necessary.
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To develop and to industrialize die reconstruction/die attach process including glue, soft solder, DAF and flip-bond die attach for new packages, introduce materials to meet the quality, yield and mission of new application.
To support assembly of engineering sample for new packages or new technologies.
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