- Woodlands North Region (Singapore) Singapore
Full Time Engineer - Test Process (WLCSP) Jobs, Salary up to SGD 5,000 in ASE SINGAPORE PTE. LTD. North Region (Singapore) - Maukerja
Engineer - Test Process (WLCSP)
ASE SINGAPORE PTE. LTD.
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Job Description
Responsibilities
Responsibilities
Support production operations across Taping, Backgrind (BG), Wafer Mounting, Laser Marking, Laser Grooving, and Dicing to ensure stable manufacturing output.
Lead new device introductions by driving recipe qualifications, data collection, and recipe optimization.
Troubleshoot process issues and manage machine setups to minimize downtime and reduce cycle times.
Conduct risk assessments to proactively identify and mitigate potential manufacturing hazards and defects.
Author and maintain critical engineering documentation, including SOPs, Work Instruction Procedures, and Out-of-Control Action Plans (OCAPs).
Generate technical reports and preserve accurate engineering data for audit readiness.
Collaborate with cross-functional teams to enforce strict SOP compliance and robust production line controls.
Drive continuous improvement by executing CIPs focused on quality enhancement, yield optimization, and cost reduction.
Enforce workplace standards, ensuring strict compliance with company policies, safety protocols, and 5S housekeeping.
Requirements
Bachelor's Degree in Engineering or a related technical discipline.
3+ years of experience within a semiconductor manufacturing environment.
Hands-on expertise operating Taping, Backgrind, Lasermark, Wafer Mount, Laser Groove, Dicing, and PSI machinery.
Strong command of core quality tools, including 8D problem-solving, FMEA, Control Plans, and SPC.
The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly and test. As a global leader geared towards meeting the industry's ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test, program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and design manufacturing services.
Support production operations across Taping, Backgrind (BG), Wafer Mounting, Laser Marking, Laser Grooving, and Dicing to ensure stable manufacturing output.
Lead new device introductions by driving recipe qualifications, data collection, and recipe optimization.
Troubleshoot process issues and manage machine setups to minimize downtime and reduce cycle times.
Conduct risk assessments to proactively identify and mitigate potential manufacturing hazards and defects.
Author and maintain critical engineering documentation, including SOPs, Work Instruction Procedures, and Out-of-Control Action Plans (OCAPs).
Generate technical reports and preserve accurate engineering data for audit readiness.
Collaborate with cross-functional teams to enforce strict SOP compliance and robust production line controls.
Drive continuous improvement by executing CIPs focused on quality enhancement, yield optimization, and cost reduction.
Enforce workplace standards, ensuring strict compliance with company policies, safety protocols, and 5S housekeeping.
Requirements
Bachelor's Degree in Engineering or a related technical discipline.
3+ years of experience within a semiconductor manufacturing environment.
Hands-on expertise operating Taping, Backgrind, Lasermark, Wafer Mount, Laser Groove, Dicing, and PSI machinery.
Strong command of core quality tools, including 8D problem-solving, FMEA, Control Plans, and SPC.
The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly and test. As a global leader geared towards meeting the industry's ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test, program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and design manufacturing services.
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