- Seremban Negeri Sembilan Malaysia
Full Time ENGR II, MANUFACTURING EQUIP MFG Jobs, in Onsemi Negeri Sembilan - Maukerja
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Job Description
Responsibilities
Die Clip Bonder Equipment Engineer
We are seeking an experienced and highly technical Senior Equipment Engineer to lead our front end assembly equipment team. You will be responsible for leading shift technicians, ensuring maximum equipment uptime, and performing advanced troubleshooting across our die bond, clip bond, reflow, and inspection lines. The ideal candidate must have strong hands-on engineering experience with ASM/CANON equipment and front end assembly processes.
Responsibilities
Technician Leadership: Lead, supervise, and mentor a team of shift technicians to ensure strict adherence to maintenance schedules and production KPIs.
Machine Issue Follow-up: Take ownership of chronic, unresolved, or escalated machine issues handed over from previous shifts, conducting deep-dive root cause analysis for permanent resolution.
Equipment Maintenance & Calibration: Oversee and execute corrective and preventive maintenance (PM) for die attach, clip bond, reflow, oven, and AOI equipment to minimize downtime.
Process Optimization: Monitor and analyze Overall Equipment Effectiveness (OEE), equipment Uptime, and Production Time to maximize line efficiency.
Cost Optimization & Spare Parts Management: Monitor and reduce maintenance operational costs by optimizing spare parts inventory, evaluating second-source suppliers, and implementing component-level repairs to extend equipment lifespan.
Continuous Improvement (Kaizen): Lead and drive continuous improvement initiatives (such as Kaizen, 5S, and Lean Six Sigma projects) to eliminate waste, improve machine efficiency, and reduce recurring equipment failure rates.
Yield & Waste Reduction: Collaborate with process engineering teams to analyze defect data, minimizing material waste and scrap during equipment setup, conversion, or buy-off phases.
Documentation: Establish, review, and update Standard Operating Procedures (SOP), troubleshooting matrices, and technical training materials for the engineering team.
Qualifications
Candidates must have hands-on experience in operation, setup, troubleshooting, or maintenance for the following equipment:
Die Bonder : ASM AD838, AD8312PLUS, DA D510, ALPHASAM
Clip Bonder : AD830CB, AD830PLUS, BESTEM-C310
Reflow & Ovens : RO830, RO832, BOCS-6 (Reflow), PINK VADU (Vacuum Soldering System)
Screen Printe r: ASM DEK
Cleaning Systems : CREST,
Automated Optical Inspection (AOI) : PENTAMASTER AOI
About Us
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
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About the Team
We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.
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