Our client is a
well-established research and technology organisation
, focusing on advanced R&D and the development of next-generation semiconductor technologies.
We are looking for an
Advanced Packaging & Process Integration Engineer
to support the research and development of advanced semiconductor packaging and heterogeneous integration technologies.
Position:
Advanced Packaging & Process Integration Engineer
Employment Type:
Full Time, Permanent
Location:
Singapore
Responsibilities:
Research and develop
fine-pitch flip-chip and hybrid bonding
technologies
Develop
Chip-to-Wafer and Wafer-to-Wafer
bonding processes
Support interposer and hybrid bond pad fabrication and process integration
Optimise bonding materials, surface preparation and process parameters
Conduct engineering experiments, process optimisation and data analysis
Improve process yield, performance and reliability
Support
2.5D / 3D heterogeneous integration
technology development
Collaborate with internal teams and external partners on R&D projects
Requirements:
Bachelor’s Degree in
Materials, Mechanical, Chemical, Electronics, Electrical, Computer Engineering
or related discipline
1–6 years
of relevant experience in microelectronics, semiconductor or component integration
Experience in
advanced packaging / process integration
is preferred
Hands-on experience in
flip-chip bonding
will be advantageous
Knowledge of
hybrid bonding equipment and materials
is advantageous
Experience in process development, data analysis and
DOE
preferred
Good analytical, problem-solving and communication skills
**Interested candidates, kindly email updated resume to
*************
with Subject of "Advanced Packaging & Process Integration Engineer", thank you.
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