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Full Time Technology Development Thin Film Process Engineer Jobs, Salary up to SGD 7,000 in United Microelectronics Corporation (Singapore Branch) East Region (Singapore) - Maukerja
Technology Development Thin Film Process Engineer
United Microelectronics Corporation (Singapore Branch)
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Job Description
Responsibilities
About the role
UMC is a leading global semiconductor foundry company. As a Process Engineer, you will develop your expertise in the semiconductor industry and improve conditions for advanced technologies through design and development experiments to provide more stable processes at lower cost and higher yield. You will establish a cooperative atmosphere with various manufacturers and engineers to jointly develop strategies and solutions to improve the company's efficiency.
Key responsibilities
Developing and optimizing wafer-to-wafer (W2W) and chip-to-wafer (C2W) bonding and debonding processes.
Evaluating and selecting suitable carriers, mounting materials, and associated processes.
Developing backside and wafer-bevel film deposition processes.
Developing low-temperature dielectric deposition processes.
Developing micro-bump (µ-bump) metallization processes, including physical vapor deposition (PVD) and electrochemical plating (ECP).
Defining process specifications, conducting experiments, analyzing data, and resolving process integration and yield issues.
Collaborating with cross-functional teams to improve process performance, reliability, manufacturability, and production readiness.
About you
Bachelor's Degree in Electronic Engineering, Electrical Electronic Engineering, Chemical Engineering, Materials Science, Mechanical Engineering or Physics
Demonstrated experience of at least 2 years in semiconductor foundry module process
22/28 nanometer and below advance technology nodes experience is highly desirable
Strong understanding of process development, optimization and troubleshooting
Proven leadership skills in leading cross-functional teams and managing projects related to process improvement or technology transfer
Ability to analyze complex process issues, identify root causes, and implement effective solutions
Experience skills including SPC, 8D reporting, DOE, FMEA and PMO is preferred
Able to commit shift work
About us
UMC is a leading global semiconductor foundry company.
UMC is a leading global semiconductor foundry company. The company provides high quality IC fabrication services, focusing on logic and various specialty technologies to serve all major sectors of the electronics industry. UMC’s comprehensive IC processing technologies and manufacturing solutions include Logic/Mixed-Signal, embedded High-Voltage, embedded Non-Volatile-Memory, RFSOI and BCD etc. Most of UMC's 12-in & 8-in fabs with its core R&D are located in Taiwan, with additional ones throughout Asia. UMC has total 12 fabs in production with combined capacity close to 800,000 wafers per month (8-in equivalent), and all of them are certified with IATF-16949 automotive quality standard.
UMC is headquartered in Hsinchu, Taiwan, plus local offices in United States, Europe, China, Japan, Korea and Singapore, with worldwide total 20,000 employees.
UMC is a leading global semiconductor foundry company. As a Process Engineer, you will develop your expertise in the semiconductor industry and improve conditions for advanced technologies through design and development experiments to provide more stable processes at lower cost and higher yield. You will establish a cooperative atmosphere with various manufacturers and engineers to jointly develop strategies and solutions to improve the company's efficiency.
Key responsibilities
Developing and optimizing wafer-to-wafer (W2W) and chip-to-wafer (C2W) bonding and debonding processes.
Evaluating and selecting suitable carriers, mounting materials, and associated processes.
Developing backside and wafer-bevel film deposition processes.
Developing low-temperature dielectric deposition processes.
Developing micro-bump (µ-bump) metallization processes, including physical vapor deposition (PVD) and electrochemical plating (ECP).
Defining process specifications, conducting experiments, analyzing data, and resolving process integration and yield issues.
Collaborating with cross-functional teams to improve process performance, reliability, manufacturability, and production readiness.
About you
Bachelor's Degree in Electronic Engineering, Electrical Electronic Engineering, Chemical Engineering, Materials Science, Mechanical Engineering or Physics
Demonstrated experience of at least 2 years in semiconductor foundry module process
22/28 nanometer and below advance technology nodes experience is highly desirable
Strong understanding of process development, optimization and troubleshooting
Proven leadership skills in leading cross-functional teams and managing projects related to process improvement or technology transfer
Ability to analyze complex process issues, identify root causes, and implement effective solutions
Experience skills including SPC, 8D reporting, DOE, FMEA and PMO is preferred
Able to commit shift work
About us
UMC is a leading global semiconductor foundry company.
UMC is a leading global semiconductor foundry company. The company provides high quality IC fabrication services, focusing on logic and various specialty technologies to serve all major sectors of the electronics industry. UMC’s comprehensive IC processing technologies and manufacturing solutions include Logic/Mixed-Signal, embedded High-Voltage, embedded Non-Volatile-Memory, RFSOI and BCD etc. Most of UMC's 12-in & 8-in fabs with its core R&D are located in Taiwan, with additional ones throughout Asia. UMC has total 12 fabs in production with combined capacity close to 800,000 wafers per month (8-in equivalent), and all of them are certified with IATF-16949 automotive quality standard.
UMC is headquartered in Hsinchu, Taiwan, plus local offices in United States, Europe, China, Japan, Korea and Singapore, with worldwide total 20,000 employees.
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