Full Time Maintenance Wire Bond Engineer Jobs, in Renesas Semiconductor KL Pulau Pinang - Maukerja

Company Description Renesas Semiconductor KL Sdn Bhd, a subsidiary of the Renesas Electronics Group, is a leading global semiconductor manufacturing company established in 1974. Located in Telok Panglima Garang, Selangor, the company produces high-quality semiconductor products such as integrated circuits, transistors, and diodes for a wide range of industrial and consumer applications. Renesas is recognized for its technology expertise in microcontrollers, system LSI devices, and analog & power devices, holding the world’s No.1 market share in MCUs. The organization is committed to customer satisfaction through quality, competitive cost, and on-time delivery, while fostering technical innovation and comprehensive employee training. Renesas strives to contribute to a world where people prosper in harmony and to build a sustainable future together.
Role Description This is a full-time, on-site Maintenance Wire Bond Engineer role based in Penang, Malaysia. The Maintenance Wire Bond Engineer is responsible for ensuring the reliable operation of wire bond equipment through routine inspections, troubleshooting, and timely repairs. Day-to-day tasks include performing preventive maintenance, monitoring equipment performance, analyzing recurring issues, and implementing corrective actions to minimize downtime and enhance productivity. The role also involves collaborating with production, engineering, and quality teams to support process improvements, maintain safety and compliance standards, and document maintenance activities and equipment histories. The engineer will participate in continuous improvement initiatives, support new equipment installation and qualification, and contribute to technical training for maintenance personnel.
Qualifications

• Candidates should possess strong skills in Equipment Maintenance and Maintenance & Repair to ensure stable and efficient wire bond operations.
• Candidates should possess solid Maintenance Engineering and Preventive Maintenance capabilities to plan, execute, and optimize maintenance programs.
• Candidates should possess Electrical Maintenance skills to diagnose and resolve electrical and control-system issues on wire bond equipment.
• Diploma or degree in Electrical, Electronic, Mechanical, or Mechatronic Engineering, or a related field.
• Experience in semiconductor back-end processes, especially wire bonding, is highly advantageous.
• Ability to interpret technical drawings, equipment manuals, and schematics, with good analytical and problem-solving skills.
• Strong commitment to safety, quality, and continuous improvement, with the ability to work in a fast-paced manufacturing environment and on rotating shifts if required.
• Effective communication skills and ability to collaborate with cross-functional teams; proficiency in basic computer applications for reporting and documentation.