- Yishun North Region (Singapore) Singapore
Full Time Process Engineer (AOI) Jobs, Salary up to SGD 5,500 in STATS ChipPAC Pte. Ltd. North Region (Singapore) - Maukerja
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Job Description
Responsibilities
About the role
Solve daily production issues through strong problem-solving abilities and practical solutions to ensure the efficiency and quality of manufacturing process. Solutions typically result in improved products, processes or quality. Provide leadership to make a difference.
Key responsibilities
Develop and optimize process to improve accuracy, cycle time, and overall efficiency
Identify and resolve issues related to process equipment, software, and results to maintain smooth production flow
Create process documentation to ensure process and product quality assurance and conduct analysis of process data, and implement corrective actions
Propose and implement continuous improvement initiatives to enhance process capabilities
Work closely with Process Engineering, Manufacturing and Quality Assurance & NPI team to ensure seamless integration of process into production
Support new product/process qualification build
Track product quality performance
New product recipe setup per Process Engineer Requirement
About you
Capability to interpret data and make data-driven decisions to enhance production efficiency and quality
Ability to quickly learn new technologies and willingness to work collaboratively in a dynamic manufacturing environment with excellent verbal and written communication skills
Ability to analyze complex issues, identify root causes, and implement effective solutions
Proficiency in Microsoft Word, Excel (basic data analysis, formulas), and PowerPoint (basic presentation skills)
Familiar on CAMTEK AOI machine will be in advantage
Strong focus in data analysis and ADC algorithm system performance, ensuring accuracy and reliability
Minimum Diploma in Engineering (Entry Level)
Join a leader in the industry!
STATS ChipPAC, a member of the JCET Group, is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services encompassing semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to customers around the world. Ranked as the third largest Outsourced Semiconductor Assembly and Test (OSAT) company, opportunities abound in growth and development as we continue to push towards new heights in this highly competitive field. Our comprehensive portfolio covers a wide spectrum of semiconductor applications servicing the telecommunications, consumer, automotive and other industries through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. Our global footprint spans over 2 top-notched R&D facilities and 6 manufacturing locations in the Asia Pacific region, with global sales outreach as our sales network provide close technology collaboration and efficient supply-chain manufacturing to our global customers.
Join us and expand your world.
Solve daily production issues through strong problem-solving abilities and practical solutions to ensure the efficiency and quality of manufacturing process. Solutions typically result in improved products, processes or quality. Provide leadership to make a difference.
Key responsibilities
Develop and optimize process to improve accuracy, cycle time, and overall efficiency
Identify and resolve issues related to process equipment, software, and results to maintain smooth production flow
Create process documentation to ensure process and product quality assurance and conduct analysis of process data, and implement corrective actions
Propose and implement continuous improvement initiatives to enhance process capabilities
Work closely with Process Engineering, Manufacturing and Quality Assurance & NPI team to ensure seamless integration of process into production
Support new product/process qualification build
Track product quality performance
New product recipe setup per Process Engineer Requirement
About you
Capability to interpret data and make data-driven decisions to enhance production efficiency and quality
Ability to quickly learn new technologies and willingness to work collaboratively in a dynamic manufacturing environment with excellent verbal and written communication skills
Ability to analyze complex issues, identify root causes, and implement effective solutions
Proficiency in Microsoft Word, Excel (basic data analysis, formulas), and PowerPoint (basic presentation skills)
Familiar on CAMTEK AOI machine will be in advantage
Strong focus in data analysis and ADC algorithm system performance, ensuring accuracy and reliability
Minimum Diploma in Engineering (Entry Level)
Join a leader in the industry!
STATS ChipPAC, a member of the JCET Group, is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services encompassing semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to customers around the world. Ranked as the third largest Outsourced Semiconductor Assembly and Test (OSAT) company, opportunities abound in growth and development as we continue to push towards new heights in this highly competitive field. Our comprehensive portfolio covers a wide spectrum of semiconductor applications servicing the telecommunications, consumer, automotive and other industries through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. Our global footprint spans over 2 top-notched R&D facilities and 6 manufacturing locations in the Asia Pacific region, with global sales outreach as our sales network provide close technology collaboration and efficient supply-chain manufacturing to our global customers.
Join us and expand your world.
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