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Full Time Wave Solder Process Engineer (PCBA) Jobs, in MVC Resources Perak - Maukerja

Wave Solder Process Engineer (PCBA)

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Working Location

  • Ipoh Perak Malaysia

Job Description

Responsibilities


Company Overview


Our client is a FTSE 250 Publicly-Listed Global Technology Leader & Premier Manufacturer of Advanced Power Conversion Solutions. Designing and manufacturing critical power controllers, converter modules, and high-reliability systems for top-tier global clients across the Healthcare, Industrial Technology, and Semiconductor Equipment sectors, the company operates an advanced electronics manufacturing site in Seri Iskandar, Perak. To elevate soldering yields, eliminate solder defects, and drive process optimization across through-hole and mixed-technology assembly lines, the engineering team is recruiting a dedicated Wave Solder Process Engineer.

Position Overview


The Wave Solder Process Engineer holds primary technical ownership of wave soldering, selective soldering, flux application, and post-solder cleaning/coating processes. Working closely with Production, NPI, and Quality teams, this role is responsible for establishing thermal soldering profiles, qualifying wave solder parameters for new products, troubleshooting soldering defects, maintaining wave equipment uptime, and driving zero-defect Statistical Process Control (SPC) across high-volume PCBA lines.

Key Responsibilities


1. Wave Soldering Process Engineering & Thermal Profiling

  • Design, formulate, and optimize wave soldering processes, conveyor speeds, pot temperatures, pre-heat zones, and wave dynamics for both new and legacy product lines.

  • Develop, update, and maintain comprehensive Process Control Plans (PCP), standard operating procedures (SOPs), and parameter logs to achieve consistent, zero-defect soldering results.

  • Conduct process qualification, recipe validation, and thermal profile characterizations for lead-free solder alloys and diverse PCB board thicknesses.

  • Evaluate soldering consumables, liquid fluxes, solder bars, and cleaning/coating chemicals to maximize solder wetting and joint reliability while minimizing dross formation.

2. Defect Analysis, Troubleshooting & Quality Control

  • Lead technical troubleshooting for soldering defects—including solder bridging, insufficient hole fill, cold joints, solder balls, webbing, flagging, and component tombstoning.

  • Inspect soldered PCB assemblies for joint integrity, wetting angle, IPC-A-610 workmanship compliance, and ionic cleanliness.

  • Apply structured problem-solving methodologies (4M, 5-Why, Fishbone, Pareto Analysis, PDCA) to conduct root-cause failure investigations and execute lasting corrective/preventive actions (CAPA).

  • Track and analyze soldering defect Pareto data and Statistical Process Control (SPC) trends to implement yield improvement initiatives.

3. Equipment Sustaining, Maintenance & NPI Transfer

  • Coordinate and perform preventive and corrective maintenance on wave soldering machinery, selective solder systems, spray fluxers, solder recovery units, and washing/coating stations.

  • Manage critical spare parts inventory, solder pot maintenance schedules, flux nozzle cleanings, and pallet/carrier fixture conditions to minimize unplanned line downtime.

  • Participate actively in New Product Introduction (NPI) reviews, evaluating pallet designs and component clearances to ensure Design for Manufacturability (DFM) prior to mass production.

  • Provide structured on-the-job technical guidance, training, and troubleshooting support to wave soldering technicians and production operators.




Requirements

  • Education: Bachelor’s Degree in Mechatronics, Electrical & Electronics, Mechanical, Industrial, or Manufacturing Engineering.

  • Technical Experience:

    • Demonstrated hands-on engineering experience in wave soldering operations, through-hole technology (THT), and PCBA manufacturing.

    • Deep technical understanding of wave machine architectures, dual/single wave dynamics, fluxer spray systems, pre-heaters, solder pallet design, and wash/conformal coating processes.

    • Strong familiarity with soldering metallurgy, lead-free alloys (SAC305/SN100C), flux chemistries, and IPC-A-610 standards.

  • Methodologies & Software:

    • Proficiency in basic engineering tools, AutoCAD 2D (for pallet/fixture reviews), and MS Office (Excel, PowerPoint).

    • Practical application of Lean/Continuous Improvement tools, SPC, 4M, 5-Why, and PDCA to drive scrap reduction and productivity gains.

  • Soft Skills:

    • Strong analytical capabilities, keen attention to detail, and a structured, hands-on approach to shopfloor troubleshooting.

    • Solid verbal and written communication skills to collaborate effectively with cross-functional manufacturing teams.

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