- Seremban Negeri Sembilan Malaysia
Working Location
Job Description
Responsibilities
About the Role
As a Development Die Bond Engineer, you will be responsible for developing, qualifying, and industrializing new die attach technologies, processes, materials, and equipment for semiconductor packaging applications. You will play a key role in bringing new products and advanced packaging solutions from concept to high-volume manufacturing.
Working closely with R&D, Product Development, Process Engineering, Quality, and Operations teams, you will drive innovation and ensure robust, scalable, and cost-effective die bond solutions that meet future technology requirements.
What will you do
Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.
D&I Statement
As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.
In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.
Important Information
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