Full Time Head of Advanced Semiconductor Packaging Design - Simulation Jobs, in MRL Consulting Group | Global Niche Technology Recruitment - Maukerja

Head of Advanced Semiconductor Packaging Design & Simulation

Location: Singapore

The Opportunity

An established and growing technology organisation is seeking an experienced Head of Advanced Semiconductor Packaging Design & Simulation to lead the development of next-generation semiconductor packaging solutions, from initial architecture and design through simulation, validation and volume production.

This is a senior technical leadership position combining deep semiconductor packaging expertise with multidisciplinary engineering leadership and team development. You will take ownership of packaging architecture, design optimisation and multiphysics simulation, working closely with silicon design, memory, board engineering, thermal management, manufacturing and external technology partners.

You will ensure that packaging solutions meet demanding performance, reliability, manufacturability, cost and delivery requirements, while building the engineering capabilities, processes and technical infrastructure to support future product development.

Key Responsibilities

Packaging Architecture & Design

• Define advanced packaging architectures, technology roadmaps and design strategies to support current and future semiconductor products.
• Lead technical decisions relating to package structures, die placement, substrate stack-ups, interconnect technologies and power delivery.
• Evaluate design feasibility, manufacturability, production yield, cost and supply-chain considerations throughout the development lifecycle.
• Lead chip, package and circuit-board co-design activities, including interconnect mapping, package layouts, routing strategies and manufacturing constraints.
• Drive technical design reviews, issue resolution and final design sign-off to ensure successful transition into manufacturing.

Simulation, Validation & Reliability

• Lead signal integrity (SI), power integrity (PI), thermal and thermomechanical analysis across complex semiconductor packaging designs.
• Establish simulation methodologies, modelling assumptions, design budgets, operating margins and technical sign-off criteria.
• Oversee prototype testing and ensure correlation between simulation results and physical measurements.
• Lead root-cause investigations into electrical, thermal, mechanical and reliability issues, driving effective corrective actions.
• Manage technical trade-offs involving performance, power delivery, cooling, structural integrity and long-term product reliability.

Manufacturing & Supplier Collaboration

• Serve as the senior technical interface with semiconductor manufacturing facilities, assembly and test partners, and substrate suppliers.
• Collaborate with product engineering, test and quality teams to support prototype builds, product qualification, yield improvement and production ramp-up.
• Evaluate manufacturing capabilities, process limitations and emerging advanced packaging technologies.
• Identify technical, manufacturing and delivery risks, developing mitigation strategies with internal teams and external partners.
• Drive continuous improvement across design, validation and manufacturing processes.

Technical Leadership & Team Development

• Build, recruit and lead a specialist team of semiconductor packaging design and simulation engineers.
• Establish technical responsibilities, project plans, resource requirements and engineering priorities.
• Define engineering standards for design reviews, version control, change management and technical documentation.
• Develop reusable simulation models, engineering methodologies, design guidelines and best practices.
• Lead complex technical decisions across multidisciplinary teams, balancing engineering requirements with commercial and programme objectives.
• Foster technical innovation, knowledge sharing and continuous improvement across the engineering organisation.

Essential Requirements

• Bachelor's degree or higher in Electrical Engineering, Microelectronics, Materials Science, Mechanical Engineering or a related discipline.
• 10+ years of relevant experience in semiconductor packaging design, development or engineering.
• Demonstrable ownership of complex semiconductor packaging programmes from initial architecture and design through validation and volume production.
• Strong understanding of advanced packaging technologies, including flip-chip and FC-BGA, substrate design, packaging materials and semiconductor assembly processes.
• Strong understanding of trade-offs involving high-speed interconnects, power delivery, thermal management, manufacturability and reliability.
• Substantial hands-on technical expertise in at least one of the following areas: package design, signal and power integrity, thermal analysis or thermomechanical simulation.
• Proven ability to direct multidisciplinary engineering analysis, challenge technical assumptions and make informed design sign-off decisions.
• Experience leading engineering teams and collaborating across design, manufacturing, quality and product development functions.
• Experience managing technical relationships with external suppliers, manufacturing partners and technology providers.
• Familiarity with relevant electronic design automation (EDA) and simulation tools, including the ability to undertake technical analysis and review specialist engineering work.
• Excellent technical communication, problem-solving and documentation skills, with professional fluency in English.

Desirable Experience

Candidates with experience in the following areas will be particularly attractive:

• Advanced 2.5D and 3D packaging design, simulation, qualification or production.
• Chiplet architectures and heterogeneous integration.
• Silicon interposers, redistribution layers (RDL), through-silicon vias (TSVs), microbumps and hybrid bonding.
• Packaging for high-performance processors, graphics processors, switching devices and complex application-specific integrated circuits (ASICs).
• Large-format or high-power semiconductor packages with demanding electrical and thermal requirements.
• Advanced substrate technologies, packaging manufacturing processes and associated supplier ecosystems.
• Scaling advanced packaging technologies from early-stage development into reliable, high-volume manufacturing.

Leadership Profile

You will combine exceptional technical judgement with the ability to lead engineering teams, influence senior stakeholders and deliver complex, multidisciplinary engineering programmes.

You will be comfortable operating across multiple technical disciplines, translating challenging product requirements into practical packaging solutions and making informed decisions where electrical, thermal, mechanical, manufacturing and commercial priorities must be balanced.

You will also bring a forward-looking approach to technology development, identifying emerging opportunities, strengthening engineering processes and building a high-performing team capable of addressing increasingly complex semiconductor packaging challenges.

The Opportunity to Make an Impact

This is an opportunity to take ownership of advanced semiconductor packaging strategy and development within a growing technology environment.

You will have significant influence over critical engineering decisions, the opportunity to build and develop specialist technical capabilities, and direct involvement in delivering next-generation semiconductor products.

The successful candidate will play a pivotal role in shaping packaging architecture, advancing simulation and validation capabilities, strengthening manufacturing partnerships and ensuring the performance, reliability and scalability of future semiconductor solutions.