Full Time Physical Failure Analysis Engineer Jobs, Salary up to MYR 4,000 in OSADI COMMERCIAL SUPPLIES SDN BHD Pulau Pinang - Maukerja

Key Responsibilities

• Perform both non-destructive and destructive physical failure analysis on semiconductor devices, PCBA, SSD products, and package assemblies.
• Execute various failure analysis techniques, including cross-section analysis, dye-and-pull testing, X-ray inspection, SEM-EDX analysis, IC decapsulation, TDR probing, and other advanced FA methods.
• Analyze physical defects such as solder cracks, PCB-related defects, die cracks, delamination, EOS/ESD damage, and package or assembly-related failures.
• Conduct defect isolation and root cause investigations for reliability issues, qualification failures, manufacturing defects, and customer-return products.
• Utilize SEM imaging and analytical techniques to evaluate device structures, material interfaces, and failure mechanisms.
• Provide detailed failure analysis reports and recommendations to support product improvement and corrective action plans.
• Support semiconductor package evaluation, reliability assessment, and qualification activities for NAND and ASIC technologies.
• Collaborate with engineering teams to optimize chip structures, package designs, and manufacturing processes based on FA findings.
• Develop and maintain package process baselines, recipes, and documentation to enhance product quality and reliability.
• Identify potential structural and packaging-related risks and recommend solutions to improve product robustness.

Qualifications & Requirements

• Bachelor’s degree or above in Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or other related engineering disciplines.
• Minimum 1 year of experience in semiconductor, IC packaging, SSD, NAND, ASIC, or PCBA failure analysis.
• Hands-on experience in physical failure analysis (PFA) of semiconductor devices and package assemblies.
• Strong understanding of semiconductor device structures, package architectures, and common failure mechanisms.
• Experience with FA equipment and techniques such as SEM, SEM-EDX, X-ray inspection, cross-sectioning, decapsulation, and related analytical methods is highly preferred.
• Good analytical, troubleshooting, and root cause investigation skills.
• Strong written and verbal communication skills in English.

Pay: RM3,000.00 - RM4,000.00 per month

Work Location: In person