Full Time Process Engineer – Encapsulation (Asymtek) Jobs, in Globetronics Pulau Pinang - Maukerja

Process Engineer – Encapsulation (Asymtek)

Location: Bayan Lepas, Penang

Employment Type: Full-Time | Permanent

Job Summary:

We are looking for a motivated Process Engineer – Encapsulation to join our semiconductor manufacturing team. The successful candidate will be responsible for developing, optimizing, and maintaining encapsulation processes using Asymtek dispensing equipment to ensure high product quality, process stability, and manufacturing efficiency. The role involves close collaboration with Production, Quality, Maintenance, and New Product Introduction (NPI) teams to support continuous improvement and new product transfers.

Key Responsibilities:

• Develop, optimize, and sustain encapsulation processes using Asymtek dispensing machines.
• Perform process setup, recipe creation, parameter optimization, and machine qualification.
• Troubleshoot process and equipment issues to minimize downtime and improve yield.
• Analyze process data and implement corrective and preventive actions (CAPA).
• Support NPI activities, product transfers, and engineering builds.
• Conduct process validation, DOE (Design of Experiments), and capability studies.
• Work closely with Quality, Production, and Maintenance teams to resolve manufacturing issues.
• Prepare and maintain process documentation, work instructions, FMEA, and control plans.
• Drive continuous improvement initiatives to enhance productivity, quality, and cost efficiency.
• Ensure compliance with EHS requirements and company quality standards.

Requirements:

• Bachelor's Degree in Engineering (Mechanical, Manufacturing, Electrical, Electronics, Mechatronics, or equivalent).
• Minimum 2–5 years of experience in semiconductor or electronics manufacturing.
• Hands-on experience with Asymtek dispensing/encapsulation equipment is required.
• Strong knowledge of encapsulation processes, dispensing technologies, and process optimization.
• Experience with DOE, SPC, FMEA, and statistical data analysis is an advantage.
• Familiarity with root cause analysis tools such as 8D, Fishbone Diagram, and 5 Why.
• Good analytical, troubleshooting, and problem-solving skills.
• Able to work independently and collaborate effectively in a cross-functional team.
• Good communication skills in English.

Preferred Skills:

• Experience with epoxy encapsulation and underfill dispensing processes.
• Knowledge of semiconductor assembly processes.
• Familiarity with Lean Manufacturing, Six Sigma, or continuous improvement methodologies.
• Experience supporting NPI and high-volume manufacturing environments.

Join our team and contribute to delivering innovative semiconductor solutions in a dynamic manufacturing environment.