Responsible for determining core aspects and success criteria for automation solutions in product manufacturing and assembly process. Drive projects in the area of production process automation for assembly solutions in co-operation with internal and external stake holder.
Work closely with the global Center of Competence (CoC) and the related sub-CoC group.
Assist in developing suitable strategies to execute governance over the core process within the area of regional responsibility defined for the BMI B Braun Technology Center- Asia Pacific (BTC-AP) in accordance with Operating Model Medical (OMM).
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Good knowledge and experience with high volume SOC manufacturing test techniques and requirements (scan, iddq, jtag, logic and memory bist, epbist, mbist, lvbist, )
Possess mixed signal and/or RF test development experience preferred
Possess with high speed interface testing (PCIE, SATA, HDMI, DMI, Transceiver, DAC/ADC, Audio) implementation will be preferred
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Responsible for determining core aspects and success criteria for automation solutions in product manufacturing and assembly process. Drive projects in the area of production process automation for assembly solutions in co-operation with internal and external stake holder.
Work closely with the global Center of Competence (CoC) and the related sub-CoC group.
Assist in developing suitable strategies to execute governance over the core process within the area of regional responsibility defined for the BMI B Braun Technology Center- Asia Pacific (BTC-AP) in accordance with Operating Model Medical (OMM).
...
Designs engineering solutions, including methods, operation sequences, and processes for the manufacturing of parts, component sub- assemblies, and final assemblies, based on established engineering principles and in accordance with general specifications and requirements.
Develops and implements cost estimates, capacity models, time standards, production area layouts, and recommendations for tooling and process requirements for new product introductions.
Collaborates and communicates with management, internal, and outsourced manufacturing and development partners regarding process and standards compliance, recording and reporting issues, and recommendations for problem resolution for manufacture of existing products.
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Good knowledge and experience with high volume SOC manufacturing test techniques and requirements (scan, iddq, jtag, logic and memory bist, epbist, mbist, lvbist, )
Possess mixed signal and/or RF test development experience preferred
Possess with high speed interface testing (PCIE, SATA, HDMI, DMI, Transceiver, DAC/ADC, Audio) implementation will be preferred
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Technical expertise in semiconductor assembly equipment, including setup, maintenance, troubleshooting, and optimization of automated tools and machinery.
Strong skills in equipment performance analysis, root-cause problem solving, and continuous improvement using data-driven methods and basic statistical tools.
Knowledge of semiconductor assembly processes (e.g., die attach, wire bond, molding, singulation, flip-chip packaging) and relevant production workflows.
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