Key Responsibilities

Component-Level Soldering: Solder and desolder fine-pitch SMT components, passives (down to 0201 or 01005 footprints), QFNs, and multi-pin connectors manually under a microscope.
BGA Rework: Operate specialized BGA rework stations to safely remove, reball, and replace high-density Ball Grid Arrays (BGAs) and System-on-Chips (SoCs).
PCB Modification: Execute complex board modifications requested by engineers, including cutting traces, adding jumper wires (blue-wiring), and scraping soldermask.

2. Debug & Failure Analysis Support

Test Point Preparation: Solder microscopic probe wires or coaxial cables to fine-pitch pins and traces to allow debug engineers to attach oscilloscopes or logic analyzers.
Visual Inspection: Conduct thorough pre- and post-rework visual inspections using high-powered microscopes and X-ray inspection systems to ensure joint integrity and check for shorts/voiding.
Scrap & Salvage Processing: Safely harvest or replace high-value components from failing units for further destructive failure analysis.

3. Quality Compliance & Maintenance

Workmanship Standards: Adhere strictly to ESD (Electrostatic Discharge) controls and automotive electronics manufacturing standards (IPC-A-610 / IPC-7711/7721).
Tool Maintenance: Maintain, calibrate, and clean laboratory rework tools, including soldering irons, hot-air stations, baking ovens, and fume extractors.

Job Requirements & Qualifications

Education: Technical high school diploma, vocational certification, or an Associate Degree in Electronics.
Certifications: Active or prior certification in IPC-A-610 and IPC-7711/7721 (Rework, Modification, and Repair of Electronic Assemblies) is highly preferred.

2. Technical Skills & Experience

Experience: 3+ years of hands-on experience in fine-pitch SMT and BGA rework within a high-volume Electronics Manufacturing Services (EMS) or repair center environment.
Microscope Proficiency: Proven ability to work comfortably under a stereo microscope for extended periods.
Equipment Literacy: Hands-on experience with hot-air rework profiles, thermal profile selectors, and precision desoldering tools.
Schematic Awareness: Ability to read basic assembly drawings, component placement maps, and silk-screen markings to accurately position components (polarity, orientation).

3. Soft Skills

Exceptional hand-eye coordination, patience, and a high attention to detail.
Strong collaboration skills to take direct technical instructions from Senior Debug Engineers.

Company: Company Size

Morrissey Factories: 501 - 1000 Employees

Average Processing Time Industry

23 days Manufacturing / Production

Benefits & Others:

Medical, Regular hours, Mondays - Fridays, Business (e.g. Shirts)

Specific Location: Sungai Petani, Kedah.

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