Own and manage the wafer dry etch process, ensuring stable performance and continuous improvement.
Provide technical leadership and timely solutions for day‑to‑day manufacturing issues.
Optimize wafer fab processes using Design of Experiments (DOE), statistical analysis, and data‑driven methodologies to improve yield, cost, quality, and cycle time.
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Manage and lead ATE Test Operation of the Reliability Lab consisting of Operators and Technicians.
Drive the team to meet On‑Time Delivery by regularly monitoring that all Reliability requests progress per committed cycle time at the Electrical Testing process, including JEDEC Test Window or equivalent requirements.
Provide Analog, Logic & Discrete ATE testing support for all device families tested across various Analog, Logic & Discrete testers.
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Leads the development and implementation of soldering, diebond and wirebond processes for new product introductions (NPI).
Collaborate with R&D, Process Engineering, and Manufacturing teams to ensure soldering diebond and wirebond processes meet design and reliability requirements.
Defines process parameters, control plans, and qualification strategies for soldering diebond and wirebondoperations.
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