Die Attach Jobs in Singapore - October 2026 - Urgent Hiring

Showing 13 jobs results for "die attach" in Singapore
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SGD2,500 - SGD5,000 Per Month

Singapore, Singapore

  • Design and development of Machines and mechanical systems.
  • Planning, Scheduling and Costing of Machines and Mechanical Modules.
  • Responsible for 3D & 2D drawings, tolerance analysis, BOM preparation. ...
CAD software (e.g. AutoCAD
+8
Posted
2 months ago
SGD2,500 - SGD5,000 Per Month

Singapore, Singapore

  • Design and development of Machines and mechanical systems.
  • Planning, Scheduling and Costing of Machines and Mechanical Modules.
  • Responsible for 3D & 2D drawings, tolerance analysis, BOM preparation. ...
CAD software (e.g. AutoCAD
+8
Posted
2 months ago
SGD2,500 - SGD5,000 Per Month

Singapore, Singapore

  • Design and development of Machines and mechanical systems.
  • Planning, Scheduling and Costing of Machines and Mechanical Modules.
  • Responsible for 3D & 2D drawings, tolerance analysis, BOM preparation. ...
CAD software (e.g. AutoCAD
+8
Posted
2 months ago
SGD2,500 - SGD5,000 Per Month

Singapore, Singapore

  • Design and development of Machines and mechanical systems.
  • Planning, Scheduling and Costing of Machines and Mechanical Modules.
  • Responsible for 3D & 2D drawings, tolerance analysis, BOM preparation. ...
CAD software (e.g. AutoCAD
+8
Posted
2 months ago
SGD2,500 - SGD5,000 Per Month

Singapore, Singapore

  • Design and development of Machines and mechanical systems.
  • Planning, Scheduling and Costing of Machines and Mechanical Modules.
  • Responsible for 3D & 2D drawings, tolerance analysis, BOM preparation. ...
CAD software (e.g. AutoCAD
+8
Posted
2 months ago
SGD2,500 - SGD5,000 Per Month

Singapore, Singapore

  • Design and development of Machines and mechanical systems.
  • Planning, Scheduling and Costing of Machines and Mechanical Modules.
  • Responsible for 3D & 2D drawings, tolerance analysis, BOM preparation. ...
CAD software (e.g. AutoCAD
+8
Posted
2 months ago

Singapore

  • Develop, characterize, qualify, and optimize die attach processes for PIC/silicon photonics dies, laser dies, and EIC-PIC hybrid assemblies, including active/passive alignment epoxy attach, AuSn/eutectic solder attach, and flip-chip bonding.
  • Establish and maintain process specifications, work instructions, control plans, and process windows (DOE-based) for sub-micron and low-single-digit-micron placement accuracy.
  • Lead root cause analysis and implement corrective/preventive actions (CAPA) for die attach-related yield loss and photonics-specific defects (e.g., optical misalignment, coupling loss, epoxy outgassing, die tilt, voids, bond-line thickness control). ...
Posted
a day ago

Singapore

  • Define, develop, prove out, and deploy manufacturing processes for new products across the transceiver assembly flow (e.g., die attach, wire bond, active alignment, and general assembly), implementing continuous improvement projects to achieve yield, throughput, efficiency, scrap, and quality targets.
  • Own manufacturing process documentation (process specs, work instructions, control plans, FMEA) and review/approve process changes implemented on the production line.
  • Maintain end-to-end manufacturing ownership: ensure all changes to product, process, materials, and equipment are managed under change control per established QMS requirements. ...
Posted
15 days ago

Singapore

  • Develop, characterize, qualify, and optimize die attach processes for PIC/silicon photonics dies, laser dies, and EIC-PIC hybrid assemblies, including active/passive alignment epoxy attach, AuSn/eutectic solder attach, and flip-chip bonding.
  • Establish and maintain process specifications, work instructions, control plans, and process windows (DOE-based) for sub-micron and low-single-digit-micron placement accuracy.
  • Lead root cause analysis and implement corrective/preventive actions (CAPA) for die attach-related yield loss and photonics-specific defects (e.g., optical misalignment, coupling loss, epoxy outgassing, die tilt, voids, bond-line thickness control). ...
Posted
24 days ago

Singapore

  • Die Attach (DB / Die Bond)
  • Wire Bond (WB)
  • Active Alignment (AA / Optical Alignment) ...
Posted
5 days ago

Singapore

  • Die Attach (DB / Die Bond)
  • Wire Bond (WB)
  • Active Alignment (AA / Optical Alignment) ...
Posted
24 days ago

Pasir Ris

Posted
24 days ago