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42 Die Attach Jobs - August 2026 - Urgent Hiring
Showing 42 jobs results for
"die attach"
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Undisclosed
Singapore
- Develop, characterize, qualify, and optimize die attach processes for PIC/silicon photonics dies, laser dies, and EIC-PIC hybrid assemblies, including active/passive alignment epoxy attach, AuSn/eutectic solder attach, and flip-chip bonding.
- Establish and maintain process specifications, work instructions, control plans, and process windows (DOE-based) for sub-micron and low-single-digit-micron placement accuracy.
- Lead root cause analysis and implement corrective/preventive actions (CAPA) for die attach-related yield loss and photonics-specific defects (e.g., optical misalignment, coupling loss, epoxy outgassing, die tilt, voids, bond-line thickness control). ...
Posted
a month ago
Undisclosed
Malaysia
- Spare parts management on usage, budget control. and work on cost reductions.
- Trouble shoot and diagnose difficult, infrequent problems in a systematic approach.
- Monitor PM activities, OEE & MTBA performance, quality and yield of assembly processes. ...
Posted
a month ago
Undisclosed
Malaysia
- To setup die reconstruction/die attach Process.
- To develop and to industrialize die reconstruction/die attach process including glue, soft solder, DAF and flip-bond die attach for new packages, introduce materials to meet the quality, yield and mission of new application.
- To support assembly of engineering sample for new packages or new technologies. ...
Posted
23 days ago
Undisclosed
- Lead the FOL team in driving process improvement initiatives and operational excellence.
- Sustain and improve process performance in terms of quality, yield, internal and external customer complaints, and lot hold rate.
- Support production to achieve WWS targets and improve machine performance and reliability. ...
Posted
a day ago
OSRAM Opto Semiconductors (Malaysia) Sdn. Bhd., Penang
Undisclosed
- Leading the DA / SMT process for flex foil in development projects. To meet time, process cost and quality requirements.
- Actively seeking the know-how of DA / SMT process, assembly and material to ensure process and material capabilities are fully considered in Design Review.
- Lead investigation and analysis of problems, yield and drive implementation of solutions. ...
Posted
a month ago
Undisclosed
Malaysia
- Define and drive equipment strategies aligned with factory and package R&D roadmaps
- Evaluate and select new equipment technologies for manufacturing processes
- Lead equipment introduction and qualification projects ...
Posted
16 days ago
Die-Layer Attach Process Development Staff Engineer Die-Layer Attach Process Development Staff Engineer
OSRAM Opto Semiconductors (Malaysia) Sdn. Bhd., Penang
Undisclosed
- Support New Product Introduction (NPI), deliver assigned process and equipment development solutions that meet or exceed project quality, cost and timeline targets to ensure successful product industrialization.
- Drive Equipment Dual Sourcing & Cost Optimization. Establish qualified second-source equipment suppliers and introduce cost-effective processes or technologies to achieve equipment sourcing resilience and cost-saving objectives. Aligned with equipment strategy and manufacturing readiness requirements. Drive continuous process improvement initiatives focused on BOM material optimization and UPH (Units Per Hour) enhancement to achieve product cost targets while maintaining quality and operational efficiency.
- Resolve Chronic Technical Issues through Innovation. Lead or contribute to the resolution of recurring manufacturing and process challenges by applying innovative, data-driven, and out-of-the-box engineering solutions to improve yield, reliability, productivity, and cost performances. ...
Posted
19 days ago
Undisclosed
KL City
- Key Responsibilities: 1.Perform die bond process task on quality hold material2.Collaborate with equipment & manufacturing team to improve DB processes and techniques.3.Assist in resolving DB-related issues to minimize production downtime. Requirements: 1.Diploma or above in Engineering or a related field.2.Working experience with DB process is preferable and recommended.3.Strong attention to detail and technical troubleshooting skills.
- #LI-DNI
Posted
2 days ago
Undisclosed
- Prepare material and tool needed based on the requirement to complete spool fabrication
- Able to perform bonding procedure during the whole process of spool assembly.
- Able to interpret spool drawing and material list to guide accurate fabrication. ...
Posted
16 days ago
SGD3,500 - SGD5,000 Per Month
Pasir Ris
- Develop new and improve existing gold, silver, and copper wire bonding process capability, stability, and quality
- Ensure wire bonding process meets customer’s specifications and requirements
- Conduct failure analysis to identity root cause of wire bonding failures and find solutions to prevent future failure ...
Posted
11 days ago
Contacthings Solution Sdn Bhd
MYR2,000 - MYR3,000 Per Month
- Membaca dan memahami cetak biru, skema, serta arahan pemasangan teknikal.
- Memasang komponen, sub-pemasangan, atau produk akhir menggunakan alat tangan, alat berkuasa, dan peralatan khas.
- Memeriksa komponen yang telah siap bagi memastikan dimensi dan kualiti mematuhi piawaian. ...
Posted
24 days ago
SGD3,500 - SGD3,500 Per Month
Singapore
- Develop new and improve existing gold, silver, and copper wire bonding process capability, stability, and quality
- Ensure wire bonding process meets customer’s specifications and requirements
- Conduct failure analysis to identity root cause of wire bonding failures and find solutions to prevent future failure ...
Posted
a month ago
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