As a Die / Clip Attach Technical Expert, you will be responsible for developing and implementing competitive technical solutions across semiconductor manufacturing processes, including Pre-Assembly, Die Bond, Wire Bond, Mold, and related areas.
This role requires strong technical expertise, project leadership, and close collaboration with cross-functional and international teams to support factory objectives and future package R&D roadmaps.What You Will Do
Respond promptly to machine breakdowns and electrical system faults to minimize production downtime and ensure operational continuity.
Perform routine inspections, condition-based monitoring, and preventive maintenance on electrical installations, power distribution systems, and facility equipment.
Monitor the performance and condition of electrical assets, identify abnormalities, and report findings with recommended corrective actions.
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Respond promptly to machine breakdowns and electrical system faults to minimize production downtime and ensure operational continuity.
Perform routine inspections, condition-based monitoring, and preventive maintenance on electrical installations, power distribution systems, and facility equipment.
Monitor the performance and condition of electrical assets, identify abnormalities, and report findings with recommended corrective actions.
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5+ years’ experience in an electronics or electro-mechanical laboratory environment.
Ability to translate schematics, block diagrams and verbal descriptions into functioning hardware, and willingness to ask questions, seek clarification, and give guidance to senior colleagues when needed.
Skilled with typical electronics lab equipment such as oscilloscopes, LCR meters, waveform generators, current probes, high voltage/high current power supplies, handheld meters, soldering, PCB troubleshooting.
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